Toshiba TECRA M9 Maintenance Manual page 322

4 Replacement Procedures
Assembly of Source PCB
1. Assembly of Source PCB & Cover shield(S).
CAUTION: Pressure or stress should not be given on Source COF & Source PCB.
Usage of gloves with anti-electric discharge coating is recommended.
To eliminate possible damage on circuits occurred by ESC.
2. Assembly of Cover shield (G).
CAUTION: Pressure or stress should not be given on Gate COF.
3. Assembly of Tape Adhesive used for Top case fixing.
4. Assembly of Tape Adhesive used for B/L Wire fixing.
CAUTION: Pressure or stress should not be given on Top case during this process.
Figure 4-71 Replacing LG.Philips fluorescent lamp (WXGA+) (8)
4-88 [CONFIDENTIAL]
4.28 Fluorescent Lamp
TECRA M9 Maintenance Manual (960-631)