Figure 7-31. Thermocouple Placed Into Groove; Figure 7-32. Removing Excess Solder - Intel BX80571E7400 - Core 2 Duo 2.8 GHz Processor Manuallines

Thermal and mechanical design guidelines

Table of Contents

Case Temperature Reference Metrology

Figure 7-31. Thermocouple placed into groove

29. Using a blade carefully shave the excess solder above the IHS surface. Only shave

in one direction until solder is flush with the groove surface (Figure 7-32).

Note: Take usual precautions when using open blades

30. Clean the surface of the IHS with Alcohol and use compressed air to remove any

remaining contaminants.

31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope

that the thermocouple wire is below the surface along the entire length of the IHS

groove (Figure 7-33).

Thermal and Mechanical Design Guidelines

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