Appendix G Mechanical Drawings; Figure 7-40. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height; Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height; Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height - Intel BX80571E7400 - Core 2 Duo 2.8 GHz Processor Manuallines

Thermal and mechanical design guidelines
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Mechanical Drawings

Appendix G Mechanical Drawings

The following table lists the mechanical drawings included in this appendix. These
drawings refer to the reference thermal mechanical enabling components for the
processor.
Note: Intel reserves the right to make changes and modifications to the design as
necessary.
ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1
ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2
ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3
. BTX Thermal Module Keep Out Volumetric – Sheet 1
BTX Thermal Module Keep Out Volumetric – Sheet 2
. BTX Thermal Module Keep Out Volumetric – Sheet 3
BTX Thermal Module Keep Out Volumetric – Sheet 4
BTX Thermal Module Keep Out Volumetric – Sheet 5
ATX Reference Clip – Sheet 1
ATX Reference Clip - Sheet 2
Reference Fastener - Sheet 1
Reference Fastener - Sheet 2
Reference Fastener - Sheet 3
Reference Fastener - Sheet 4
®
Intel
E18764-001 Reference Solution Assembly
Thermal and Mechanical Design Guidelines
Drawing Description
Page Number
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
111

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