IBM NeXtScale System Planning And Implementation Manual page 83

Intel Turbo Boost Technology
Memory population
Maximum memory speed
Memory RAS features
PCIe lanes
TDP values (W)
Idle power targets (W)
Figure 4-5 shows the IBM NeXtScale nx360 M4 building block.
DIMM
DIMM
DIMM
Processor 1
DIMM
DDR3 DIMMs
4 memory channels
1 DIMM per channel
DIMM
DIMM
DIMM
Processor 2
DIMM
Figure 4-5 IBM NeXtScale nx360 M4 system board block diagram
Xeon E5-2600
(Sandy Bridge-EP)
4 channels of up to 3 RDIMMs, 3 LRDIMMs, or 2 UDIMMs
Up to 1600 MHz
ECC, Patrol Scrubbing, Sparring, Mirroring, Lockstep Mode, x4/x8
15 W or higher
12 W for low-voltage SKUs
x4 ESI link
Intel
Xeon
QPI
links
Intel
Xeon
Chapter 4. IBM NeXtScale nx360 M4 compute node
Xeon E5-2600 v2
(Ivy Bridge-EP)
Yes
Up to 1866 MHz
SDDC
40 PCIe 3.0 lanes
130, 115, 96, 80, 70, 60, 50 W
10.5 W or higher
7.5 W for low-voltage SKUs
2x 6 Gbps AHCI &
2x 3 Gbps AHCI
Intel
Internal
USB
C602J
PCH
USB
Front KVM port
x1 USB
Video &
serial
IMM v2
Dedicated RJ45 port
GbE
PCIe 3.0 x4
PCIe 3.0 x24
PCIe riser slot
PCIe 3.0 x8
Mezzanine slot
PCIe 3.0 x16
GPU riser slot
1x 3.5" or
2x 2.5" or
4x 1.8"
Two GbE
ports (RJ45)
65