Glossary - Intel MFSYS25V2 Specification

Technical product specification
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Intel® Compute Module MFS5520VI TPS
This appendix contains important terms used in the preceding chapters. For ease of use,
numeric entries are listed first (for example, "82460GX") followed by alpha entries (for example,
"AGP 4x"). Acronyms are followed by non-acronyms.
Term
ACPI
Advanced Configuration and Power Interface
AP
Application Processor
APIC
Advanced Programmable Interrupt Control
ASIC
Application Specific Integrated Circuit
ASMI
Advanced Server Management Interface
BIOS
Basic Input/Output System
BIST
Built-In Self Test
BMC
Baseboard Management Controller
Bridge
Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP
Bootstrap Processor
byte
8-bit quantity.
CBC
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK
Common Enabling Kit
CHAP
Challenge Handshake Authentication Protocol
CMOS
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board.
DPC
Direct Platform Control
EEPROM
Electrically Erasable Programmable Read-Only Memory
EHCI
Enhanced Host Controller Interface
EMP
Emergency Management Port
EPS
External Product Specification
ESB2
Enterprise South Bridge 2
FBD
Fully Buffered DIMM
FMB
Flexible Mother Board
FRB
Fault Resilient Booting
FRU
Field Replaceable Unit
FSB
Front-Side Bus
GB
1024MB
GPIO
General Purpose I/O
GTL
Gunning Transceiver Logic
HSC
Hot-Swap Controller
Hz
Hertz (1 cycle/second)
I2C
Inter-Integrated Circuit Bus
®
IA
Intel
Architecture
IBF
Input Buffer
ICH
I/O Controller Hub
ICMB
Intelligent Chassis Management Bus
IERR
Internal Error
Revision 1.5

Glossary

Definition
Intel order number: E64311-007
Glossary
47

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