Unified Retention System Support; Figure 5. Unified Retention System And Unified Backplate Assembly - Intel MFSYS25V2 Specification

Functional Architecture
3.1.6

Unified Retention System Support

The Compute Module complies with Intel's Unified Retention System (URS) and the Unified
Backplate Assembly. The Compute Module ships with a made-up assembly of Independent
Loading Mechanism (ILM) and Unified Backplate at each processor socket.
The URS retention transfers load to the Compute Module through the unified backplate
assembly. The URS spring, captive in the heatsink, provides the necessary compressive load
for the thermal interface material. All components of the URS heatsink solution are captive to
the heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly.
See the following figure for the stacking order of the URS components.
.
Heatsink
Server Board
ILM and Socket
ILM Attach Studs
Heatsink
Attach Studs

Figure 5. Unified Retention System and Unified Backplate Assembly

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Intel order number: E64311-007
Intel® Compute Module MFS5520VI TPS
Screw
Compression Spring
Retention Cup
Retaining Ring
Thermal Interface Material (TIM)
Unified Backplate
AF002699
Revision 1.5