Intel MFSYS25V2 Specification
Intel MFSYS25V2 Specification

Intel MFSYS25V2 Specification

Technical product specification
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Intel
Modular Server System
®
Technical Product Specification
Intel order number E15155-010
Revision 1.7
March, 2011
Enterprise Platforms and Services Division

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Summary of Contents for Intel MFSYS25V2

  • Page 1 Intel Modular Server System ® Technical Product Specification Intel order number E15155-010 Revision 1.7 March, 2011 Enterprise Platforms and Services Division...
  • Page 2: Revision History

    Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
  • Page 3: Table Of Contents

    Intel® Modular Server System TPS Table of Contents Table of Contents 1. Product Overview......................... 1 2. System Overview........................2 Introduction ......................2 External Chassis Features – Front ................5 2.2.1 Compute Module ..................... 6 2.2.2 Storage Enclosure ....................6 2.2.3 I/O Cooling Module ....................
  • Page 4 Table of Contents Intel® Modular Server System TPS 3.5.4 Drawings........................ 26 3.5.5 Architectural Overview................... 26 Ethernet Switch Module..................27 3.6.1 Introduction ......................27 3.6.2 Mechanical Outline ....................28 3.6.3 Block Diagram ....................... 29 3.6.4 Architectural Overview................... 29 Storage Controller Module..................30 3.7.1...
  • Page 5 Figure 6. View of Intel Modular Server System MFSYS35 System Board Connectivity.... 10 Figure 7. Server Management Connectivity................12 ® Figure 8. Front View of Empty Intel Modular Server System MFSYS25 ........16 ® Figure 9. Front View of Empty Intel Modular Server System MFSYS35 ........
  • Page 6 List of Tables Intel® Modular Server System TPS List of Tables Table 1. Server Platform Feature List ................... 2 Table 2. Environmental Specifications Summary ............... 14 Table 3. Physical Specifications of Chassis................14 Table 4. Physical Dimensions of Hardware Components ............15 Table 5.
  • Page 7 Intel® Modular Server System TPS List of Tables < This page intentionally left blank. > Revision 1.7 Intel order number E15155-010...
  • Page 8: Product Overview

    Modular Server System MFSYS25V2 ® Intel Modular Server System MFSYS35 Note: All references in the document to MFSYS25 are for both MFSYS25 and MFSYS25V2. Exceptions will call out either MFSYS25 or MFSYS25V2. ® The Intel Modular Server System MFSYS25/MFSYS35 supports up to six dual-processor ®...
  • Page 9: System Overview

    Ethernet switches, and redundant storage controllers. The server ships configured for rack mounting, but may be mounted in a pedestal configuration. ® The following table lists and briefly describes the features of the Intel Modular Server System MFSYS25/MFSYS35 .
  • Page 10: Figure 1. Intel Modular Server System Mfsys25 Wiring Diagram

    Intel® Modular Server System TPS System Overview Feature Description Cooling The cooling subsystem consists of three cooling zones. I/O module cooling Hard drives and power supplies Compute modules Each cooling zone contains dedicated hot-swap fan modules. Each fan module contains a status LED to indicate a fan failure.
  • Page 11: Figure 2. Intel Modular Server System Mfsys35 Wiring Diagram

    System Overview Intel® Modular Server System TPS ® Figure 2. Intel Modular Server System MFSYS35 Wiring Diagram Revision 1.7 Intel order number E15155-010...
  • Page 12: External Chassis Features - Front

    Item Description Compute modules (six) Storage enclosure: ® Modular 14 hot-swap 2.5-inch SAS hard disk drives – Intel Server System MFSYS25 only ® 6 hot-swap 3.5-inch SAS/SATA hard disk drives – Intel Modular Server System MFSYS35 only I/O cooling module System Fault LED (amber) Figure 3.
  • Page 13: Compute Module

    Modular Server System MFSYS25/MFSYS35 supports an optional hard disk drive storage enclosure and has the following minimum features: ® Bays for 14 hot-swap 2.5-inch SAS hard disk drives in the Intel Modular Server System ® MFSYS25 and six (6) 3.5-inch SAS/SATA hard drives in the Intel...
  • Page 14: External Chassis Features - Rear

    Intel® Modular Server System TPS System Overview External Chassis Features – Rear The following figure shows the rear view of the platform with all modules populated. AF002564 Item Description Power supply units (four, 3+1) Main cooling modules (required) Ethernet switch modules...
  • Page 15: Chassis Management Module

    (1+1) cooling redundancy. Cooling module 1 cools compute modules 1-3; cooling module 2 cools compute modules 4-6. Internal Chassis Features ® The following figures provide an internal view of how the Intel Modular Server System MFSYS25/MFSYS35 system boards are connected. Revision 1.7...
  • Page 16: Figure 5. View Of Intel Modular Server System Mfsys25 System Board Connectivity

    Intel® Modular Server System TPS System Overview Item Description Server board 14-drive backplane Interposer board (connects drive backplane to midplane) I/O fan controller Midplane board Compute module fan controllers Storage controller boards Switch module boards Chassis management module board ®...
  • Page 17: Midplane Board

    System Overview Intel® Modular Server System TPS Item Description Server board 6-drive backplane Interposer board (connects drive backplane to midplane) I/O fan controller Midplane board Compute module fan controllers Storage controller boards Switch module boards Chassis management module board ®...
  • Page 18: Storage Interposer Board

    Rails ® The platform accommodates rails to mount the chassis into a standard 19-inch rack. The Intel Modular Server System MFSYS25/MFSYS35 uses fixed rails. All customer-accessible components provide either front or rear access. The rails attach to the rack using a tool-less mechanism.
  • Page 19: Chassis Management Module

    SYSTEM FAN MODULE Figure 7. Server Management Connectivity 2.6.1 Chassis Management Module ® The main controller in the chassis management module is an Intel XScale IXP425 ® microcontroller or an Intel EP80579 Integrated Processor that runs Linux to provide a robust operating environment.
  • Page 20: Reliability, Availability, Serviceability, Usability, Manageability (Rasum)

    Intel® Modular Server System TPS System Overview Reliability, Availability, Serviceability, Usability, Manageability (RASUM) The platform supports the following reliability, availability, serviceability, usability and manageability (RASUM) features: Reliability features o Voltage and temperature monitoring throughout the system Availability features o Hot-plug compute modules...
  • Page 21: System Details

    System Details Intel® Modular Server System TPS 3. System Details Specifications 3.1.1 Environmental Specifications Summary ® The following table describes the environmental specifications of the Intel Modular Server System MFSYS25/MFSYS35 Table 2. Environmental Specifications Summary Environment Specification Temperature operating 10°C to 35°C 50°F to 95°F...
  • Page 22: Power Specifications Summary

    132.6 mm 416.9 mm 3.1.3 Power Specifications Summary ® The following table provides a summary of the 12V power budget for all modules in the Intel Modular Server System MFSYS25/MFSYS35 . Table 5. Power Budget of Hardware Components Subsystem 12V Budget...
  • Page 23: Chassis

    ® The following two figures show the front view of an empty Intel Modular Server System MFSYS25/MFSYS35 . Note that the hard drive bay is installed and the hard drive backplane is visible on the left side of the chassis.
  • Page 24: Figure 9. Front View Of Empty Intel Modular Server System Mfsys35

    Intel® Modular Server System TPS System Details ® Figure 9. Front View of Empty Intel Modular Server System MFSYS35 Revision 1.7 Intel order number E15155-010...
  • Page 25: Figure 10. Rear View Of Empty Intel

    System Details Intel® Modular Server System TPS ® The following two figures show the rear view of an empty Intel Modular Server System MFSYS25/MFSYS35 . The midplane is installed and is visible through the empty I/O and power supply module areas.
  • Page 26: Midplane Board

    Intel® Modular Server System TPS System Details Midplane Board This section describes the platform’s midplane board. The midplane is the central board that connects to all removable modules. The midplane board, like the chassis, is designed to accommodate multiple generations of compute modules, I/O modules and storage controllers without the need to upgrade or modify the board.
  • Page 27: Renderings

    System Details Intel® Modular Server System TPS 3.3.2 3D Renderings This section contains perspective views of the midplane board. Figure 13. Front View of Midplane Board Revision 1.7 Intel order number E15155-010...
  • Page 28: Compute Module

    Intel® Modular Server System TPS System Details Figure 14. Rear View of Midplane Board Compute Module ® This section describes the platform’s compute module at a high level. Refer to the Intel Compute Module MFS5000SI Technical Product Specification for additional details. 3.4.1 Introduction ®...
  • Page 29: Drawings

    There are no Ethernet connections to the power supply modules, cooling ® modules, or LED boards.) The main components of the CMM2 are the Intel EP80579 Integrated Processor, which runs the Linux OS in addition to the built-in server control GUI, and the FPGA, which provides I²C bus expansion among other functionality.
  • Page 30 Intel® Modular Server System TPS System Details Note: All references in the document to CMM are for both CMM and CMM2. Exceptions will call out either CMM or CMM2. Revision 1.7 Intel order number E15155-010...
  • Page 31: Mechanical Outline

    System Details Intel® Modular Server System TPS 3.5.2 Mechanical Outline Figure 16. Chassis Management Module Board Outline (Top View) Revision 1.7 Intel order number E15155-010...
  • Page 32: Block Diagram

    Intel® Modular Server System TPS System Details 3.5.3 Block Diagram 3.5.3.1 The following block diagram divides the chassis management module into physical and functional blocks. Arrows represent buses and signals. Blocks represent the physical and functional circuits. The following figure illustrates the general architecture of the chassis management module.
  • Page 33: Drawings

    System Details Intel® Modular Server System TPS Figure 18. Chassis Management Module 2 Block Diagram 3.5.4 Drawings The following figure shows the front view of the CMM. Figure 19. Front View of Chassis Management Module 3.5.5 Architectural Overview The chassis management module provides configuration and management capabilities for the ®...
  • Page 34: Ethernet Switch Module

    Intel® Modular Server System TPS System Details accessible Server Control. The 10/100 Ethernet port on the front panel of the CMM provides the ® main interface to the Intel Modular Server System MFSYS25/MFSYS35. The CMM runs the Linux operating system in addition to the built-in server control GUI application.
  • Page 35: Mechanical Outline

    System Details Intel® Modular Server System TPS 3.6.2 Mechanical Outline The following figure shows the mechanical outline of the ESM. Figure 20. Ethernet Switch Module Mechanical Outline (Top View) Revision 1.7 Intel order number E15155-010...
  • Page 36: Block Diagram

    Intel® Modular Server System TPS System Details 3.6.3 Block Diagram Figure 21. Ethernet Switch Module Block Diagram 3.6.4 Architectural Overview The ESM provides networking and switch functions to the compute modules. Each compute module is capable of accessing up to two ESMs through point-to-point links across the midplane.
  • Page 37: Storage Controller Module

    SAS disk drives. Connectivity between the storage controller modules and the disk drive backplane is achieved through an ® interposer card to a 14-drive backplane in the Intel Modular Server System MFSYS25 and a 6- ®...
  • Page 38: Storage Controller Module View

    Intel® Modular Server System TPS System Details 3.7.3 Storage Controller Module View Figure 23. Front View of Storage Controller Module 3.7.4 Architectural Overview 3.7.4.1 Storage Controller Module Interface The Interposer SAS signals from the storage controller module (SCM) originate from the LSI* 1068 and PM8399* devices.
  • Page 39: Power Supply Module

    5 V and 12 V power. Power Supply Module ® The power supply module in Intel Modular Server System MFSYS25/MFSYS35 is a 1000-W DC output supply with 110-240V AC input. Each power supply includes two fans that provide cooling for optional hot-swap disk drives.
  • Page 40: Jumpers And Leds

    Jumpers and LEDs ® The compute module is the only module with jumper headers. Refer to the Intel Compute Module MFS5000SI Technical Product Specification for details on the function and location of the server jumpers.
  • Page 41: Product Regulatory Requirements

    4.1.3 Product Ecology Compliance Intel has a system in place to restrict the use of banned substances in accordance with world wide regulatory requirements. A Material Declaration Data Sheet is available for Intel products. For more reference on material restrictions and compliance you can view Intel's Environmental Product Content Specification at http://supplier.intel.com/ehs/environmental.htm.
  • Page 42: Certifications/Registrations/Declarations

    Packaging & Product Recycling Marks Product Regulatory Compliance Markings This Intel Server Chassis product is provided with the following regulatory and safety markings. In the event there is no room for a marking(s) on the chassis, the information is provided here in this document.
  • Page 43 Product Regulatory Requirements Intel® Modular Server System TPS Requirement Country Marking cULus Listing USA/Canada Marks GS Mark Germany CE Mark Europe FCC Marking (Class A) EMC Marking Canada (Class A) VCCI Marking Japan (Class A) Revision 1.7 Intel order number E15155-010...
  • Page 44 Russia Marking KCC Mark Korea Note: The following is the former Korean EMC mark and is seen on older Intel products. KCC Mark Korea Note: The following symbol is the new Korean EMC mark and is seen on newer Intel products.
  • Page 45 Product Regulatory Requirements Intel® Modular Server System TPS Requirement Country Marking 金属部件 (Metal Parts) 印刷板.件 (Printed Board Assemblies (PBA)) ○:表'.有毒有害物.在.部件所有均.材料中的含量均在 SJ/T 11363-2006 .准.定的 限量要求以下。 ○: Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T 11363-2006.
  • Page 46 Intel® Modular Server System TPS Product Regulatory Requirements Requirement Country Marking Waste of Europe Electronic and Electrical Equipment Recycling Mark China China Restriction of Hazardous Substance Environmental Friendly Use Period Mark China China Recycling Mark Recycling International Marks Battery California Perchlorate Material - Special handling may apply.
  • Page 47: Regulated Specified Components

    Interchanging or use of other component will void the UL listing and other product certifications and approvals. You can find updated product information for configurations on the Intel Server Builder Web site at the following URL: http://channel.intel.com/go/serverbuilder.
  • Page 48: Electromagnetic Compatibility Notices

    Intel® Modular Server System TPS Product Regulatory Requirements 3. Add-in Boards: Must have a printed wiring board flammability rating of minimum UL94V-1. Add-in boards containing external power connectors and/or lithium batteries must be UL recognized or UL listed. Any add-in board containing modem telecommunication circuitry must be UL listed.
  • Page 49: Ices-003 (Canada)

    Product Regulatory Requirements Intel® Modular Server System TPS 4.4.2 ICES-003 (Canada) Cet appareil numŽrique respecte les limites bruits radioŽlectriques applicables aux appareils numŽriques de Classe A prescrites dans la norme sur le matŽriel brouilleur: “Appareils NumŽriques”, NMB-003 ŽdictŽe par le Ministre Canadian des Communications.
  • Page 50: Vcci (Japan)

    Intel® Modular Server System TPS Product Regulatory Requirements 4.4.4 VCCI (Japan) English translation of the notice above: This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference.
  • Page 51 Product Regulatory Requirements Intel® Modular Server System TPS Perchlorate Material - special handling may apply. See: http://www.dtsc.ca.gov/hazardouswaste/perchlorate. This notice is required by California Code of Regulations, Title 22, Division 4.5, and Chapter 33: Best Management Practices for Perchlorate Materials. This product/part includes a battery which contains perchlorate material.
  • Page 52: Glossary

    Intel® Modular Server System TPS Glossary Glossary This appendix contains important terms used in the preceding sections. Acronyms are followed by non-acronyms. Word/Acronym Definition ACPI Advanced Configuration and Power Interface BIOS Basic Input/Output System Baseboard Management Controller European Conformity (Conformité Européenne) CISPR Special International Committee on Radio Interference (Comité...
  • Page 53 Glossary Intel® Modular Server System TPS Word/Acronym Definition Intelligent Management Bus IPMB Intelligent Platform Management Bus IPMI Intelligent Platform Management Interface In-System Programmable Information Technology Equipment In-Target Probe JTAG Joint Test Action Group Keyboard, VDU, and Mouse Local Area Network...
  • Page 54 Intel® Modular Server System TPS Glossary Word/Acronym Definition SEEPROM Serial Electrically Erasable Programmable Read-Only Memory System Event Log SerDes Serializer/Deserializer SMASH CLP Systems Management Architecture for Server Hardware/Command Line Protocol Symmetric Multiprocessing SNMP Simple Network Management Protocol Serial Over LAN Transistor-Transistor Logic Technical Monitoring Association (Technischer Überwachungsverein)
  • Page 55: Reference Documents

    Reference Documents Intel® Modular Server System TPS Reference Documents See the following documents for additional information: SCSI Accessed Fault-Tolerant Enclosures Interface Specification (SAF-TE) ® Intel Compute Module MFS5000SI Technical Product Specification (TPS) ® Intel Modular Server System Tested Hardware and Operating Systems List (THOL) IPMI Specification, Version 2.0...

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