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.
Table 2-6.
Processor Absolute Minimum and Maximum Ratings
Symbol
V
CC
V
TTA
V
TTD
V
DDQ
V
CCPLL
T
CASE
T
STORAGE
Notes:
1.
For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
2.
Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
3.
V
and V
TTA
2.11
Processor DC Specifications
The processor DC specifications in this section are defined at the processor
pads, unless noted otherwise. See
Chapter 5
Table
2-7. For platform planning, refer to
transient tolerances. This same information is presented graphically in
The DC specifications for the DDR3 signals are listed in
and Test Access Port (TAP) are listed in
Table 2-7
only while meeting specifications for case temperature (T
"Thermal
read all notes associated with each parameter.
22
Parameter
Processor Core voltage with respect to V
Voltage for the analog portion of the integrated
memory controller, QPI link and Shared Cache
with respect to V
SS
Voltage for the digital portion of the integrated
memory controller, QPI link and Shared Cache
with respect to V
SS
Processor I/O supply voltage for DDR3 with
respect to V
SS
Processor PLL voltage with respect to V
Processor case temperature
Storage temperature
should be derived from the same VR.
TTD
for signal definitions. Voltage and current specifications are detailed in
through
Table 2-15
list the DC specifications for the processor and are valid
Specifications"), clock frequency, and input voltages. Care should be taken to
Min
-0.3
SS
—
—
—
1.65
SS
See
Chapter 6
See
Chapter 6
Chapter 4
for the processor land listings and
Table
2-8, which provides V
Table
Table 2-12
through
Table
as specified in
CASE
Electrical Specifications
1, 2
Max
Unit
Notes
1.55
V
1.35
V
3
1.35
V
3
1.875
V
1.89
V
See
C
Chapter 6
See
C
Chapter 6
static and
CC
Figure
2-3.
2-11. Control Sideband
2-15.
Chapter 6,
Datasheet
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