Intel I7-900 DESKTOP PROCESSOR - DATASHEET VOLUME 1 Datasheet page 4

7 Features ..................................................................................................................83
7.1 Power-On Configuration (POC).............................................................................83
7.2 Clock Control and Low Power States .....................................................................83
7.2.1 Thread and Core Power State Descriptions .................................................84
7.2.2 Package Power State Descriptions .............................................................85
7.3 Sleep States .....................................................................................................86
7.4 ACPI P-States (Intel
7.5 Enhanced Intel
8 Boxed Processor Specifications................................................................................89
8.1 Introduction ......................................................................................................89
8.2 Mechanical Specifications ....................................................................................90
8.2.1 Boxed Processor Cooling Solution Dimensions.............................................90
8.2.2 Boxed Processor Fan Heatsink Weight .......................................................92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....92
8.3 Electrical Requirements ......................................................................................92
8.3.1 Fan Heatsink Power Supply ......................................................................92
8.4 Thermal Specifications........................................................................................93
8.4.1 Boxed Processor Cooling Requirements......................................................93
8.4.2 Variable Speed Fan .................................................................................95
Figures
1-1 High-Level View of Processor Interfaces ................................................................. 9
2-1 Active ODT for a Differential Link Example ............................................................13
2-2 Input Device Hysteresis ......................................................................................21
2-3 VCC Static and Transient Tolerance Load Lines ......................................................25
2-4 VTT Static and Transient Tolerance Load Line ........................................................27
2-5 VCC Overshoot Example Waveform ......................................................................30
3-1 Processor Package Assembly Sketch.....................................................................31
3-2 Processor Package Drawing (Sheet 1 of 2) ............................................................32
3-3 Processor Package Drawing (Sheet 2 of 2) ............................................................33
3-4 Processor Top-side Markings ...............................................................................35
3-5 Processor Land Coordinates and Quadrants (Bottom View) ......................................36
6-1 Processor Thermal Profile....................................................................................73
6-2 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ..........75
6-3 Frequency and Voltage Ordering ..........................................................................77
7-1 Power States.....................................................................................................84
8-1 Mechanical Representation of the Boxed Processor .................................................89
8-2 Space Requirements for the Boxed Processor (side view) ........................................90
8-3 Space Requirements for the Boxed Processor (top view) .........................................91
8-4 Space Requirements for the Boxed Processor (overall view) ....................................91
8-5 Boxed Processor Fan Heatsink Power Cable Connector Description............................92
8-6 Baseboard Power Header Placement Relative to Processor Socket.............................93
8-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) .................94
8-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ................94
8-9 Boxed Processor Fan Heatsink Set Points ..............................................................95
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Turbo Boost Technology) .....................................................86
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SpeedStep Technology .............................................................87
Datasheet