Figure 7-31. Thermocouple Placed Into Groove; Figure 7-32. Removing Excess Solder - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

Mechanical design guidelines
Table of Contents

Advertisement

Case Temperature Reference Metrology

Figure 7-31. Thermocouple placed into groove

29. Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (Figure 7-32).

Figure 7-32. Removing Excess Solder

Note: Take usual precautions when using open blades
30. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
Thermal and Mechanical Design Guidelines
99

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the E6700 - Core 2 Duo Dual-Core Processor and is the answer not in the manual?

Questions and answers

Table of Contents