Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition And Height - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3
8 7
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI
1
D
19.25
3.00
A
2.75
C
2.50
45 X 3.50
27.25
37.00
B
5.80
NOTES:
1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC
CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES
WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS).
2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET
A
AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION.
IT ENCOMPASSES SOCKET AND CPU PACKAGE DIMENSIONAL TOLERANCES
AND DEFLECTION / SHAPE CHANGES DUE TO DSL LOAD.
3. SOCKET KEEP-IN VOLUME ENCOMPASS THE SOCKET NOMINAL VOLUME
AND ALLOWANCES FOR SIZE TOLERANCES. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH
CLEARANCE MARGINS. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME.
8 7
112
6 5
DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
OR WRITTEN CONSENT OF INTEL CORPORAT ION.
49.00
SOCKET & PROCESSOR VOLUMETRIC KEEP-IN
2X
24.50
45 X 3.00
R33.29
29.00
R49.44
32.85
A
3.00
3.00
LEVER MOTION SPACE
REQUIRED TO RELEASE
SOCKET LOAD PLATE
5.80
SECTION A-A 3.80
6 5
4 3
( 37.60 )
14.10
6.60
30.00
120.0
1.00
3.80
8.15 2
LEVER MOTION SPACE
REQUIRED TO RELEASE
SOCKET LOAD PLACE
( 46.11 )
TOP SIDE VIEW
DEPARTMENT
TMD
4 3
Mechanical Drawings
1
DWG. NO SHT. REV
C40819 3 3
( 37.60 )
14.60
6.60
SOCKET HOUSING 1
D
CAVITY (CPU PACKAGE)
( 16.00 )
C
SOCKET BALL 1
( 16.87 )
( 55.58 )
(FARSIDE)
B
A
BOTTOM SIDE VIEW
SIZE CAGE CODE DRAWING NUMBER REV
R 2200 MISSION COLLEGE BLVD.
C40819
D
3
P.O. BOX 58119
CORP.
SANTA CLARA, CA 95052-8119
SCALE: NONE DO NOT SCALE DRAWING SHEET 3 OF 3
2 1
Thermal and Mechanical Design Guidelines