Reference Attach Mechanism; Structural Design Strategy; Figure 6-5. Upward Board Deflection During Shock - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

6.7

Reference Attach Mechanism

6.7.1

Structural Design Strategy

Structural design strategy for the reference design is to minimize upward board
deflection during shock to help protect the LGA775 socket.
The reference design uses a high clip stiffness that resists local board curvature under
the heatsink, and minimizes, in particular, upward board deflection (Figure 6-5). In
addition, a moderate preload provides initial downward deflection.

Figure 6-5. Upward Board Deflection during Shock

The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target
for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The
nominal preload provided by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb].
Note: Intel reserves the right to make changes and modifications to the design as necessary
to the reference design, in particular the clip and fastener.
60
ATX Thermal/Mechanical Design Information
Shock Load
Less curvature in
region under stiff clip
Thermal and Mechanical Design Guidelines