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BX80570E8400 - Core 2 Duo 3 GHz Processor
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Manuals and User Guides for Intel BX80570E8400 - Core 2 Duo 3 GHz Processor. We have
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Intel BX80570E8400 - Core 2 Duo 3 GHz Processor manual available for free PDF download: Design Manual
Intel BX80570E8400 - Core 2 Duo 3 GHz Processor Design Manual (126 pages)
Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 3.42 MB
Table of Contents
Table of Contents
3
1 Introduction
9
Document Goals and Scope
9
Importance of Thermal Management
9
Document Goals
9
Document Scope
10
References
11
Definition of Terms
11
2 Processor Thermal/Mechanical Information
13
Mechanical Requirements
13
Processor Package
13
Figure 2-1. Package IHS Load Areas
13
Heatsink Attach
15
General Guidelines
15
Heatsink Clip Load Requirement
15
Additional Guidelines
16
Thermal Requirements
16
Processor Case Temperature
16
Thermal Profile
17
Thermal Solution Design Requirements
17
Figure 2-2. Processor Case Temperature Measurement Location
17
Tcontrol
18
Figure 2-3. Example Thermal Profile
18
Heatsink Design Considerations
19
Heatsink Size
20
Heatsink Mass
20
Package IHS Flatness
21
Thermal Interface Material
21
System Thermal Solution Considerations
22
Chassis Thermal Design Capabilities
22
Improving Chassis Thermal Performance
22
Table 2-1. Heatsink Inlet Temperature of Intel
22
Table 2-2. Heatsink Inlet Temperature of Intel
22
Summary
23
System Integration Considerations
23
3 Thermal Metrology
25
Characterizing Cooling Performance Requirements
25
Example
26
Figure 3-1. Processor Thermal Characterization Parameter Relationships
26
Processor Thermal Solution Performance Assessment
27
Local Ambient Temperature Measurement Guidelines
27
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink
29
Processor Case Temperature Measurement Guidelines
30
4 Thermal Management Logic and Thermal Monitor Feature
31
Processor Power Dissipation
31
Thermal Monitor Implementation
31
PROCHOT# Signal
32
Thermal Control Circuit
32
Thermal Monitor
32
Thermal Monitor 2
33
Figure 4-1. Thermal Monitor Control
33
Operation and Configuration
34
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering
34
On-Demand Mode
35
System Considerations
35
Operating System and Application Software Considerations
36
THERMTRIP# Signal
36
Cooling System Failure Warning
36
Digital Thermal Sensor
37
Platform Environmental Control Interface (PECI)
38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
39
Overview of the BTX Reference Design
39
Target Heatsink Performance
39
Acoustics
40
Table 5-2. Acoustic Targets
40
Effective Fan Curve
41
Voltage Regulator Thermal Management
42
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
42
Table 5-3. VR Airflow Requirements
42
Altitude
43
Reference Heatsink Thermal Validation
43
Environmental Reliability Testing
43
Structural Reliability Testing
43
Random Vibration Test Procedure
43
Shock Test Procedure
44
Figure 5-2. Random Vibration PSD
44
Figure 5-3. Shock Acceleration Curve
44
Power Cycling
45
Recommended Bios/Cpu/Memory Test Procedures
46
Material and Recycling Requirements
46
Safety Requirements
47
Geometric Envelope for Intel Reference BTX Thermal Module Assembly
47
Figure 5-4. Intel ® Type II TMA 65W Reference Design
47
Preload and TMA Stiffness
48
Structural Design Strategy
48
TMA Preload Verse Stiffness
48
Figure 5-5. Upward Board Deflection During Shock
48
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness
49
Table 5-4. Processor Preload Limits
49
Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features
50
6 ATX Thermal/Mechanical Design Information
51
ATX Reference Design Requirements
51
Figure 6-1. E18764-001 Reference Design - Exploded View
52
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
52
Validation Results for Reference Design
53
Heatsink Performance
53
Table 6-1. E18764-001 Reference Heatsink Performance
53
Acoustics
54
Altitude
54
Table 6-2. Acoustic Results for ATX Reference Heatsink (E18764-001)
54
Heatsink Thermal Validation
55
Environmental Reliability Testing
55
Structural Reliability Testing
55
Random Vibration Test Procedure
55
Shock Test Procedure
56
Figure 6-3. Random Vibration PSD
56
Figure 6-4. Shock Acceleration Curve
56
Power Cycling
57
Recommended Test Sequence
57
Recommended Bios/Cpu/Memory Test Procedures
58
Material and Recycling Requirements
58
Safety Requirements
59
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
59
Reference Attach Mechanism
60
Structural Design Strategy
60
Figure 6-5. Upward Board Deflection During Shock
60
Mechanical Interface to the Reference Attach Mechanism
61
Figure 6-6. Reference Clip/Heatsink Assembly
61
Figure 6-7. Critical Parameters for Interfacing to Reference Clip
62
Figure 6-8. Critical Core Dimension
62
7 Intel® Quiet System Technology (Intel® QST)
63
Intel ® QST Algorithm
63
Output Weighting Matrix
64
Proportional-Integral-Derivative (PID)
64
Figure 7-1. Intel ® QST Overview
64
Figure 7-2. PID Controller Fundamentals
65
Board and System Implementation of Intel
66
Qst
66
Figure 7-3. Intel ® QST Platform Requirements
66
Figure 7-4. Example Acoustic Fan Speed Control Implementation
67
Intel QST Configuration and Tuning
68
Fan Hub Thermistor and Intel
68
Qst
68
Figure 7-5. Digital Thermal Sensor and Thermistor
68
Appendix Alga775 Socket Heatsink Loading
69
LGA775 Socket Heatsink Considerations
69
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
69
Heatsink Preload Requirement Limitations
69
Motherboard Deflection Metric Definition
70
Table 7-1. Board Deflection Configuration Definitions
70
Board Deflection Limits
71
Figure 7-6. Board Deflection Definition
71
Board Deflection Metric Implementation Example
72
Additional Considerations
73
A.3.4 Additional Considerations
73
Figure 7-7. Example-Defining Heatsink Preload Meeting Board Deflection Limit
73
Motherboard Stiffening Considerations
74
Heatsink Selection Guidelines
74
Appendix B Heatsink Clip Load Metrology
75
Overview
75
Test Preparation
75
Heatsink Preparation
75
B.1 Overview
75
B.2 Test Preparation
75
B.2.1 Heatsink Preparation
75
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
76
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View
77
Figure 7-10. Preload Test Configuration
77
Typical Test Equipment
78
Test Procedure Examples
78
Table 7-2. Typical Test Equipment
78
Preload Degradation under Bake Conditions
79
Time-Zero, Room Temperature Preload Measurement
79
Appendix C Thermal Interface Management
81
Bond Line Management
81
Interface Material Area
81
Interface Material Performance
81
Appendix D Case Temperature Reference Metrology
83
Objective and Scope
83
Supporting Test Equipment
83
Figure 7-11. Omega Thermocouple
84
Thermal Calibration and Controls
85
IHS Groove
85
D.4 IHS Groove
85
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit
86
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 O'clock Exit
87
Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package
88
Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the LGA775 Socket
88
Thermocouple Attach Procedure
89
Thermocouple Conditioning and Preparation
89
Figure 7-16. Inspection of Insulation on Thermocouple
89
Thermocouple Attachment to the IHS
90
Figure 7-17. Bending the Tip of the Thermocouple
90
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
90
Figure 7-19. Thermocouple Bead Placement
91
Figure 7-20. Position Bead on the Groove Step
92
Figure 7-21. Detailed Thermocouple Bead Placement
92
Figure 7-22. Third Tape Installation
93
Figure 7-23. Measuring Resistance between Thermocouple and IHS
93
Figure 7-24. Applying Flux to the Thermocouple Bead
94
Figure 7-25. Cutting Solder
94
Solder Process
95
D.5.3 Solder Process
95
Figure 7-26. Positioning Solder on IHS
95
Figure 7-27. Solder Station Setup
96
Figure 7-28. View through Lens at Solder Station
97
Figure 7-29. Moving Solder Back Onto Thermocouple Bead
97
Cleaning and Completion of Thermocouple Installation
98
Figure 7-30. Removing Excess Solder
98
Figure 7-31. Thermocouple Placed into Groove
99
Figure 7-32. Removing Excess Solder
99
Figure 7-33. Filling Groove with Adhesive
100
Figure 7-34. Application of Accelerant
100
Figure 7-35. Removing Excess Adhesive from IHS
101
Figure 7-36. Finished Thermocouple Installation
101
Thermocouple Wire Management
102
Figure 7-37. Thermocouple Wire Management
102
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations
103
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified
104
Figure 7-39. Thermal Sensor Location Illustration
105
Appendix F Fan Performance for Reference Design
107
Table 7-3. Fan Electrical Performance Requirements
107
Appendix G Mechanical Drawings
109
Restrictions for Enabling Components - Sheet 1
109
Restrictions for Enabling Components - Sheet 2
109
Restrictions for Enabling Components - Sheet 3
109
Figure 7-40. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
110
Figure 7-41. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
111
Figure 7-42. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
112
Figure 7-43. BTX Thermal Module Keep out Volumetric - Sheet 1
113
Figure 7-44. BTX Thermal Module Keep out Volumetric - Sheet 2
114
Figure 7-45. BTX Thermal Module Keep out Volumetric - Sheet 3
115
Figure 7-46. BTX Thermal Module Keep out Volumetric - Sheet 4
116
Figure 7-47. BTX Thermal Module Keep out Volumetric - Sheet 5
117
Figure 7-48. ATX Reference Clip - Sheet 1
118
Figure 7-49. ATX Reference Clip - Sheet 2
119
Figure 7-50. Reference Fastener - Sheet 1
120
Figure 7-51. Reference Fastener - Sheet 2
121
Figure 7-52. Reference Fastener - Sheet 3
122
Figure 7-53. Reference Fastener - Sheet 4
123
Figure 7-54. Intel ® E18764-001 Reference Solution Assembly
124
Intel Enabled Reference Solution Information
125
Design
125
Table 7-5. E18764-001 Reference Thermal Solution Providers
125
Table 7-6. BTX Reference Thermal Solution Providers
126
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