Solder Process; D.5.3 Solder Process; Figure 7-26. Positioning Solder On Ihs - Intel E6700 - Core 2 Duo Dual-Core Processor Design Manual

Case Temperature Reference Metrology
16. Place the two pieces of solder in parallel, directly over the thermocouple bead
(Figure 7-26).

Figure 7-26. Positioning Solder on IHS

17. Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3

Solder Process

18. Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature
19. Verify the temperature of the Heater block station has reached 155 °C ±5 °C
before you proceed.
20. Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
Thermal and Mechanical Design Guidelines 95