Thermal Performance; Optional Blower; Figure 2 Thermal Performance; Figure 3 Thermal Performance - Alpha Data ADM-PCIE-8K5 User Manual

2.3 Thermal Performance

The ADM-PCIE-8K5 comes with a heat sink to reduce the heat of the FPGA which is typically the hottest point on
the card. The FPGA die temperature must remain under 100 degrees Celsius or the system monitor will clear the
FPGA design to ensure the card does not overheat. To calculate the FPGA die temperature, take your application
power and multiply by Theta JA from the table below, and add your systems internal ambient temperature. If you
are using the fan provided with the board, you will find Theta JA is approximately 1.6 degC/W for the board.
The power dissipation can be estimated by using the Alpha Data power estimator in conjuction with the Xilinx
Power Estimator (XPE) downloadable at http://www.xilinx.com/products/technology/power/xpe.html. Download
the UltraScale tool and set the Device to Kintex UltraScale, KU115, FLVA1517, -2, Extended. Set the ambient
temperature to your system ambient and select User Override for the Effective theta JA and enter the figure
associated with your system LFM in the blank field. Proceed to enter all applicable design elements and
utilization in the following spreadsheet tabs. Next aquire the 8K5 power estimator from Alpha Data by contacting
support@alpha-data.com. You will then plug in the FPGA power figures along with DDR4 and SFP usage to get
an estimated board level power dissipation.
The graph below shows Theta JA of the board with two 3.5 watt QSFP loopback connectors inserted.

2.4 Optional Blower

Because it is possible for generic PC chassis to not provide sufficient airflow to cool the FPGA, the
ADM-PCIE-8K5 is shipped with an uninstalled blower. The blower is optional and can be easily installed with a
Philips screw driver at the discretion of the user. Before screwing in the blower, plug in the small power connector
into the right angle connector along the back edge of the board. The blower hangs off the back of the PCB
outside of the PCIe card envelope.
Page 4
Figure 2 : Thermal Performance
Figure 3 : Thermal Performance
ADM-PCIE-8K5 User Manual
PCB Information
ad-ug-1319_v1_12.pdf