Thermal Performance; Customizations; Figure 3 Thermal Performance - Alpha Data ADM-PCIE-9V8 User Manual

2.3 Thermal Performance

If the FPGA core temperature exceeds 105 degrees Celsius, the FPGA design will be cleared to prevent the card
from over-heating.
The ADM-PCIE-9V8 comes with a heat sink to help avoid thermal overstress of FPGA, since it is typically the
hottest point on the card. The FPGA die temperature must remain under 100 degrees Celsius. To calculate the
FPGA die temperature, take your application power, multiply by Theta JA from the table below, and add to your
system internal ambient temperature.
The power dissipation can be estimated by using the Alpha Data power estimator in conjunction with the AMD
Xilinx Power Estimator (XPE) downloadable at http://www.xilinx.com/products/technology/power/xpe.html.
Download the UltraScale tool and set the device according to your part number details: Virtex UltraScale+, VU2P.
Set the ambient temperature to your system ambient and select 'user override' for the effective theta JA and
enter the figure associated with your system LFM in the blank field. Proceed to enter all applicable design
elements and utilization in the following spreadsheet tabs. Next acquire the 9V5 power estimator from Alpha Data
by contacting support@alpha-data.com. You will then plug in the FPGA power figures along with Optical module
figures to get a board level estimate.

2.4 Customizations

Alpha Data provides extensive customization options to existing commercial off-the-shelf (COTS) products.
Some options include, but are not limited to: additional networking cages in adjacent slots, enhanced heat sinks,
baffles, and circuit additions.
Please contact sales@alpha-data.com to get a quote and start your project today.
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ADM-PCIE-9V8 Board Level Thermal Performance
1.30
1.20
1.10
1.00
0.90
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Linear Feet per Minute (LFM)
Figure 3 : Thermal Performance
(estimate)
ADM-PCIE-9V8 User Manual
Board Information
ad-ug-1467_v1_0.pdf