Processor And Heatsink Installation - Supermicro SuperServer SYS-111E-FWTR-EU User Manual

3.3 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together first to form the
processor carrier assembly. This assembly will be then attached to the heatsink to form
the processor heatsink module (PHM) before being installed into the CPU socket. Before
installation, be sure to perform the following steps below:
•
Use ESD precaution.
•
Remove power as described in
•
Check that the plastic protective cover is on the CPU socket, and none of the socket pins
are bent. If they are, contact your retailer.
•
When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
•
When installing the processor and heatsink, ensure a torque driver set to the correct force
is used for each screw.
•
Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
•
Refer to the Supermicro website for updates on processor and memory support.
•
The CPU carriers XCC (SKT-1333L-0000-FXC) and MCC (SKT-1424L-001B-FXC) are
shipped with the motherboard.
•
All graphics in this manual are for illustrations only. Your components may look different.
Note 1: The 4th Gen Intel® Xeon® Scalable Processor comes with three CPU SKUs:
SP XCC, SP MCC, and HBM. The 5th Gen Intel® Xeon® Scalable Processor comes
with two CPU SKUs: SP XCC and SP MCC.
Note 2: The SP XCC CPU supports Carrier E1A; HBM CPU supports Carrier E1C,
and SP MCC, Carrier E1B.
Note 3: The installation process is the same for both 4th and 5th Gen Intel Xeon
Scalable processors.
Chapter 3: Maintenance and Component Installation
Section 3.1.
32