Processor And Heatsink Installation; The 4Th Generation Intel Xeon Scalable Processor - Supermicro X13SEFR-A User Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together first to form the
processor carrier assembly. This will be attached to the heatsink to form the processor heatsink
module (PHM) before being installed onto the CPU socket.
Notes:
•
Use ESD protection.
•
Shut down the system and then unplug the AC power cord from all power supplies.
•
Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
•
When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or socket, which may require manufacturer repairs.
•
Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
•
Refer to the Supermicro website for updates on processor support.
•
All graphics in this manual are for illustration purposes only. Your components may look
different.
•
Order the CPU carrier with the CPU heatsink.
CPU carrier for 4th Generation Intel
Xeon Scalable Processors (XCC)
CPU carrier for 4th Generation Intel
Xeon Scalable Processors (MCC)
CPU carrier for 4th Generation Intel
Xeon Scalable Processors (HBM)

The 4th Generation Intel Xeon Scalable Processor

SKT-1333L-0000-FXC
SKT-1424L-001B-FXC
SKT-1425H-001C-FXC
Intel Xeon Processor
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Chapter 2: Installation