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Quectel EG91 Series Hardware Design

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EG91 Series
Hardware Design
LTE Standard Module Series
Version: 2.1
Date: 2021-11-05
Status: Released

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  • Page 1 EG91 Series Hardware Design LTE Standard Module Series Version: 2.1 Date: 2021-11-05 Status: Released...
  • Page 2 LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
  • Page 5 LTE Standard Module Series metal powders. 4 / 105 EG91_Series_Hardware_Design...

  • Page 6: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Barret XIONG/ 2017-03-22 Initial Rex WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4.
  • Page 7 LTE Standard Module Series Updated module operating frequencies in Table 22. 10. Added description GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1. Added new variants EG91-NS, EG91-V, EG91-EC and related contents.
  • Page 8 LTE Standard Module Series 1. Added ThreadX variant EG91-NAX and updated related contents (Table 1 and 4, Chapter 2.2, 2.3, 3.2 and 5). 2. Added related notes of SPI interface not supported on ThreadX modules (Chapter 3.1, 3.3 and 3.13). Barret XIONG/ 3.
  • Page 9 LTE Standard Module Series 10. Updated module storage information (Chapter 8.1). 11. Updated the cooling down slope of reflow soldering thermal profile; Added a note to clarify the precautions if a conformal coating is necessary for the module (Chapter 8.2). Added the related information of EG91-NAL Barret XIONG/ in the whole document.

  • Page 10: Table Of Contents

    LTE Standard Module Series Contents Safety Information..............................3 About the Document..............................5 Contents..................................9 Table Index.................................11 Figure Index................................13 Introduction............................... 15 Product Concept...............................17 2.1. General Description..........................17 2.2. Features............................18 2.3. Functional Diagram..........................21 2.4. Evaluation Board...........................22 Application Interfaces.............................23 3.1. General Description..........................23 3.2. Assignment.............................
  • Page 11 LTE Standard Module Series 4.1. General Description..........................58 4.2. GNSS Performance..........................58 4.3. Layout Guidelines..........................59 Antenna Interfaces............................60 5.1. Main/Rx-diversity Antenna Interfaces....................60 5.1.1. Definition..........................60 5.1.2. Operating Frequency.........................61 5.1.3. Reference Design of RF Antenna Interface................62 5.2. GNSS Antenna Interface........................63 5.3. Reference Design of RF Layout......................64 5.4.
  • Page 12 Table 37: EG91-NAXD Current Consumption...................... 80 Table 38: EG91-NAXDL Current Consumption....................81 Table 39: EG91-VX Current Consumption......................82 Table 40: GNSS Current Consumption of EG91 Series Module...............83 Table 41: RF Output Power............................83 Table 42: EG91-AUX Conducted RF Receiving Sensitivity................84...
  • Page 13 LTE Standard Module Series Table 43: EG91-E Conducted RF Receiving Sensitivity..................85 Table 44: EG91-EX Conducted RF Receiving Sensitivity.................. 85 Table 45: EG91-NA Conducted RF Receiving Sensitivity.................. 86 Table 46: EG91-NAL Conducted RF Receiving Sensitivity................86 Table 47: EG91-NAX Conducted RF Receiving Sensitivity................
  • Page 14 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ..........................22 Figure 2: Pin Assignment (Top View)........................24 Figure 3: Sleep Mode Application via UART......................33 Figure 4: Sleep Mode Application with USB Remote Wakeup................33 Figure 5: Sleep Mode Application with RI......................34 Figure 6: Sleep Mode Application without Suspend Function................
  • Page 15 LTE Standard Module Series Figure 42: EG91-E Bottom Dimensions (Top View).................... 93 Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom Dimensions (Top View)....94 Figure 44: Recommended Footprint (Top View)....................95 Figure 45: Top View of the Module......................... 96 Figure 46: EG91-E Bottom View..........................96 Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom View..........97 Figure 48: Recommended Reflow Soldering Thermal...

  • Page 16: Introduction

    This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG91 series module. With application note and user guide, you can use EG91 series module to design and set up mobile applications easily.
  • Page 17 LTE Standard Module Series For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above).

  • Page 18: Product Concept

    The following table shows the frequency bands EG91 series module contains Data + Voice version and Data-only version. Data + Voice version supports voice and data functions, while Data-only version only supports data function.

  • Page 19: Key Features

    EG91-VX FDD: B4/B13 With a compact profile of 29.0 mm × 25.0 mm × 2.3 mm, EG91 series module can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.
  • Page 20 LTE Standard Module Series The following table describes the detailed features of EG91 series module. Table 2: Key Features of EG91 Series Module Feature Details  Supply voltage: 3.3–4.3 V Power Supply  Typical supply voltage: 3.8 V  Class 4 (33 dBm ±2 dB) for GSM850 ...
  • Page 21  Data update rate: 1 Hz by default  Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands  Quectel enhanced AT commands Network Indication  NETLIGHT pin for network activity status indication Antenna Interfaces  Main antenna interface (ANT_MAIN),...

  • Page 22: Functional Diagram

     DFOTA RoHS  All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of EG91 series module and illustrates the major functional parts.  Power management Baseband  DDR + NAND flash ...

  • Page 23: Evaluation Board

    Figure 1: Functional Diagram 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 series module. The evaluation tool kit includes the evaluation board (UMTS&LTE EVB), a USB to RS-232 converter cable, an earphone, antennas and other peripherals.

  • Page 24: Application Interfaces

    LTE Standard Module Series Application Interfaces 3.1. General Description EG91 series module is equipped with 106 LGA pins that can be connected to your cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters: ...

  • Page 25: Pin Assignment

    LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of EG91 series module. ANT_DIV (EG91-E)/ANT_GNSS (EG91-AUX/-EX/-NA/-NAL/-NAX/ -NAXD/-NAXDL/-VX) USIM_GND PCM_CLK USIM1_CLK PCM_SYNC USIM1_DATA USIM2_PRESENCE PCM_DIN USIM1_RST PCM_DOUT USIM1_VDD USIM2_CLK USIM1_PRESENCE USB_VBUS USB_DP USIM2_RST I2C_SDA USB_DM I2C_SCL...

  • Page 26: Pin Description

    Pin 56 is RESERVED on EG91-E, while it is defined as ANT_DIV on EG91-EX/-NA/-NAL/-NAX/ -NAXD/-NAXDL/-VX. Rx-diversity antenna is not supported on EG91-AUX. 3.3. Pin Description The following tables show the pin definition and description of EG91 series module. Table 3: Definition of I/O Parameters Type...
  • Page 27 LTE Standard Module Series Table 4: Pin Description Power Supply Pin Name Description Comment Characteristics Power supply for the Vmax = 4.3 V It must be provided with VBAT_BB 32, 33 module’s baseband Vmin = 3.3 V sufficient current up to part Vnom = 3.8 V 0.8 A.
  • Page 28 LTE Standard Module Series Vmax = 5.25 V USB connection Typical value: 5.0 V USB_VBUS Vmin = 3.0 V detec If unused, keep it open. Vnom = 5.0 V USB differential USB_DP USB 2.0 compliant data (+) Require differential USB differential impedance of 90 Ω.
  • Page 29 LTE Standard Module Series For 1.8 V (U)SIM: Vmax = 1.9 V Vmin = 1.7 V Either 1.8 V or 3.0 V is (U)SIM2 card power supported by the module USIM2_VDD For 3.0 V (U)SIM: supply automatically. Vmax = 3.05 V If unused, keep it open.
  • Page 30 LTE Standard Module Series min = 1.35 V If unused, keep it open. Data carrier detect Clear to send Request to send min = -0.3 V 1.8 V power domain. max = 0.6 V Pulled up by default. Data terminal ready min = 1.2 V Low level wakes up the Sleep mode control...
  • Page 31 LTE Standard Module Series Pin Name Description Comment Characteristics I2C serial clock (for I2C_SCL An external pull-up to external codec) 1.8 V is required. I2C serial data If unused, keep it open. I2C_SDA (for external codec) ADC Interface Pin Name Description Comment Characteristics...

  • Page 32: Operating Modes

    LTE Standard Module Series Other Pins Pin Name Description Comment Characteristics 1.8 V power domain. min = -0.3 V Pull-up by default. Airplane mode max = 0.6 V At low voltage level, W_DISABLE# control min = 1.2 V module can enter max = 2.0 V airplane mode.

  • Page 33: Power Saving

    For details of the above AT command, see document [3]. 3.5. Power Saving 3.5.1. Sleep Mode EG91 series module is able to reduce its current consumption to a minimum value during the sleep mode. The following sub-chapters describe the power saving procedures of EG91 series module. 3.5.1.1. UART Application If the host communicates with the module via UART interface, the following preconditions can let the module enter sleep mode.
  • Page 34 Figure 3: Sleep Mode Application via UART Driving the host DTR to low level will wake up the module.  When EG91 series module has a URC to report, RI signal will wake up the host. See Chapter 3.17 for details about RI behavior. ...
  • Page 35 Sending data to EG91 series module through USB will wake up the module.  When EG91 series module has a URC to report, the module will send remote wakeup signals via USB bus to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is needed to wake up the host.

  • Page 36: Airplane Mode

    NOTE Pay attention to the level match shown in dotted line between the module and the host. Refer to document [2] for more details about EG91 series module power management application. For details of AT+QSCLK, see document [3]. For details of AT+QCFG, see document [5] .

  • Page 37: Power Supply

    The execution of AT+CFUN will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG91 series module provides four VBAT pins for connection with an external power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part.
  • Page 38 LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR.

  • Page 39: Reference Design For Power Supply

    LTE Standard Module Series 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
  • Page 40 When EG91 series module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY.

  • Page 41: Turn Off Module

    LTE Standard Module Series The power-up scenario is illustrated in the following figure. NOTE 1 VBAT ≥ 500 ms = 0 . 8 V PWRKEY ≤ 0.5 V About 100 ms VDD_EXT ≥ 100 ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit.
  • Page 42 LTE Standard Module Series 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released. The power-down scenario is illustrated in the following figure. Figure 13: Power-down Timing 3.7.2.2.

  • Page 43: Reset The Module

    LTE Standard Module Series 3.8. Reset the Module The RESET_N pin can be used to reset the module. The module can be reset by driving RESET_N to a low level voltage for 150–460 ms. Table 8: Pin Definition of RESET_N Pin Name Pin No.

  • Page 44: U)Sim Interfaces

    Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG91 series module provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The (U)SIM1 and (U)SIM2 cards can be switched by AT+QDSIM. For more details, refer to document [3].
  • Page 45 PRESENCE If unused, keep it open. EG91 series module supports (U)SIM card hot-plug via USIM_PRESENCE (USIM1_PRESENCE/USIM2 _PRESENCE) pin, and both high and low level detection are supported. The function is disabled by default, and see AT+QSIMDET in document [3] for more details.
  • Page 46 LTE Standard Module Series If (U)SIM card detection function is not needed, keep USIM_PRESENCE unconnected. A reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. USIM_VDD 100 nF USIM_GND (U)SIM Card Connector USIM_VDD USIM_RST Module...

  • Page 47: Usb Interface

    LTE Standard Module Series 3.10. USB Interface EG91 series module contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface acts as slave only, and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB.

  • Page 48: Uart Interfaces

    LTE Standard Module Series A common mode choke L1 is recommended to be added in series between the module and your MCU to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default.
  • Page 49 LTE Standard Module Series Request to send Data terminal ready Sleep mode control Transmit Receive Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. Description Comment DBG_TXD Debug UART transmit 1.8 V power domain. If unused, keep it open. DBG_RXD Debug UART receive The module provides 1.8 V UART interfaces.

  • Page 50: Pcm And I2C Interfaces

    Please note that the CTS and RTS pins of the hardware flow control for the UART port are directly connected, and pay attention to the input and output directions. 3.12. PCM and I2C Interfaces EG91 series module provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: ...
  • Page 51 LTE Standard Module Series EG91 series module supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK.
  • Page 52 Figure 24: Reference Circuit of PCM Application with Audio Codec NOTE It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuit on the PCM traces, especially for PCM_CLK. EG91 series works as a master device pertaining to I2C interface. 51 / 105 EG91_Series_Hardware_Design...

  • Page 53: Spi Interface

    LTE Standard Module Series 3.13. SPI Interface SPI interface of EG91 series module works as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip selection. Its operation voltage is 1.8 V with clock rates up to 50 MHz.

  • Page 54: Network Status Indication

    LTE Standard Module Series 3.14. Network Status Indication The module provides one network indication pin: NETLIGHT. The pin is used to drive a network status indication LED. The following tables describe the pin definition and logic level changes of NETLIGHT in different network status.

  • Page 55: Status

    LTE Standard Module Series 3.15. STATUS The STATUS pin is set as the module’s operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 17: Pin Definition of STATUS Pin Name Pin No.

  • Page 56: Behaviors Of Ri

    LTE Standard Module Series The following table describes the characteristics of ADC interface. Table 19: Characteristics of ADC Interface Parameter Min. Typ. Max. Unit ADC0 Voltage Range VBAT_BB ADC Resolution bits NOTE It is prohibited to supply any voltage to ADC pins when ADC pins are not powered by VBAT. It is recommended to use resistor divider circuit for ADC application.

  • Page 57: Usb_Boot Interface

    LTE Standard Module Series 3.18. USB_BOOT Interface EG91 series module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface.
  • Page 58 LTE Standard Module Series Figure 29: Emergency Download Mode Timing NOTE Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. When using MCU to control module to enter the emergency download mode, follow the above timing sequence.

  • Page 59: Gnss Receiver

    EG91 series module supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EG91 series module GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, see document [4].

  • Page 60: Layout Guidelines

    LTE Standard Module Series @ open sky XTRA enabled Accuracy Autonomous CEP-50 < 2.5 (GNSS) @ open sky NOTE Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.

  • Page 61: Antenna Interfaces

    LTE Standard Module Series Antenna Interfaces EG91 series module antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/ -NAXDL/-NAL/-VX.

  • Page 62: Operating Frequency

    LTE Standard Module Series 5.1.2. Operating Frequency Table 24: Module Operating Frequencies 3GPP Band Transmit Receive Unit GSM850 824–849 869–894 EGSM900 880–915 925–960 DCS1800 1710–1785 1805–1880 PCS1900 1850–1910 1930–1990 WCDMA B1 1920–1980 2110–2170 WCDMA B2 1850–1910 1930–1990 WCDMA B4 1710–1755 2110–2155 WCDMA B5 824–849...

  • Page 63: Reference Design Of Rf Antenna Interface

    LTE Standard Module Series LTE-FDD B66 1710–1780 2110–2180 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 30: Reference Circuit of RF Antenna Interface NOTE EG91-AUX does not support Rx-diversity.

  • Page 64: Gnss Antenna Interface

    LTE Standard Module Series 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG91-NA/-VX/-EX/-NAX/-NAXD/-NAXDL/-AUX/-NAL. The following tables show pin definition and frequency specification of GNSS antenna interface. Table 25: Pin Definition of GNSS Antenna Interface Pin Name Pin No.

  • Page 65: Reference Design Of Rf Layout

    LTE Standard Module Series NOTE An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Reference Design of RF Layout For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω.
  • Page 66 LTE Standard Module Series Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to ...

  • Page 67: Antenna Installation

    LTE Standard Module Series 5.4. Antenna Installation 5.4.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 27: Antenna Requirements Type Requirements Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) GNSS Passive antenna gain: >...

  • Page 68: Recommended Rf Connector For Antenna Installation

    LTE Standard Module Series 5.4.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors 67 / 105 EG91_Series_Hardware_Design...
  • Page 69 LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, visit http://www.hirose.com. 68 / 105 EG91_Series_Hardware_Design...

  • Page 70: Reliability , Radio And Electrical Characteristics

    LTE Standard Module Series Reliability , Radio and Electrical Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 28: Absolute Maximum Ratings Parameter Min.

  • Page 71: Operating And Storage Temperatures

    LTE Standard Module Series burst transmission level on EGSM900 Peak supply current Maximum power control (during transmission VBAT level on EGSM900 slot) USB connection USB_VBUS 5.25 detection 6.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table. Table 30: Operating and Storage Temperatures Parameter Min.
  • Page 72 LTE Standard Module Series AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 5 (USB suspend) GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 64 (USB suspend) WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB suspend) LTE-FDD PF = 256 (USB disconnected)
  • Page 73 LTE Standard Module Series DCS1800 3DL/2UL @ 29.23 dBm 258.0 DCS1800 2DL/3UL @ 27.19 dBm 332.4 DCS1800 1DL/4UL @ 26.14 dBm 419.1 PCS1900 4DL/1UL @ 30.22 dBm 155.0 PCS1900 3DL/2UL @ 29.48 dBm 259.5 PCS1900 2DL/3UL @ 27.50 dBm 333.1 PCS1900 1DL/4UL @ 26.44 dBm 416.8 GSM850 4DL/1UL PCL = 8 @ 25.75 dBm...
  • Page 74 LTE Standard Module Series WCDMA B2 HSDPA @ 22.14 dBm 557.4 WCDMA B2 HSUPA @ 21.18 dBm 539.4 WCDMA B5 HSDPA @ 22.6 dBm 588.2 WCDMA B5 HSUPA @ 21.45 dBm 545.2 WCDMA B8 HSDPA @ 21.92 dBm 578.1 WCDMA B8 HSUPA @ 21.93 dBm 592.5 LTE-FDD B1 @ 22.96 dBm 777.4...
  • Page 75 LTE Standard Module Series Table 32: EG91-E Current Consumption Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 5 (USB suspended) GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 64 (USB suspended) WCDMA PF = 512 (USB disconnected)
  • Page 76 LTE Standard Module Series DCS1800 1DL/4UL @ 28.86 dBm EGSM900 4DL/1UL PCL = 8 @ 27.1 dBm EGSM900 3DL/2UL PCL = 8 @ 27.16 dBm EGSM900 2DL/3UL PCL = 8 @ 26.91 dBm EGSM900 1DL/4UL PCL = 8 @ 26.12 dBm EDGE data transfer DCS1800 4DL/1UL PCL = 2 @ 25.54 dBm DCS1800 3DL/2UL PCL = 2 @ 25.68 dBm...
  • Page 77 LTE Standard Module Series OFF state Power down μA AT+CFUN=0 (USB disconnected) GSM DRX = 2 (USB disconnected) GSM DRX = 5 (USB suspend) GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) Sleep state WCDMA PF = 64 (USB suspend) WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB suspend)
  • Page 78 LTE Standard Module Series EGSM900 4DL/1UL PCL = 8 @ 27.29 dBm 169.5 EGSM900 3DL/2UL PCL = 8 @ 27.01 dBm 305.06 EGSM900 2DL/3UL PCL = 8 @ 26.86 dBm EGSM900 1DL/4UL PCL = 8 @ 25.95 dBm EDGE data transfer DCS1800 4DL/1UL PCL = 2 @ 26.11 dBm DCS1800 3DL/2UL PCL = 2 @ 25.8 dBm...
  • Page 79 LTE Standard Module Series AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 64 (USB suspended) Sleep state WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB suspended) LTE-FDD PF = 256 (USB disconnected) WCDMA PF = 64 (USB disconnected) 14.0 WCDMA PF = 64 (USB connected)
  • Page 80 LTE Standard Module Series Table 35: EG91-NAL Current Consumption Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) 0.91 LTE-FDD PF=64 (USB disconnected) 2.47 Sleep state LTE-FDD PF=64 (USB suspend) LTE-FDD PF=256 (USB disconnected) 1.55 LTE-FDD PF=64 (USB disconnected) 19.1 Idle state LTE-FDD PF=64 (USB active)
  • Page 81 LTE Standard Module Series WCDMA PF = 64 (USB connected) 32.2 LTE-FDD PF = 64 (USB disconnected) 14.0 LTE-FDD PF = 64 (USB connected) 32.6 WCDMA B2 HSDPA @ 21.74 dBm WCDMA B2 HSUPA @ 21.47 dBm WCDMA B4 HSDPA @ 22.67 dBm WCDMA data transfer WCDMA B4 HSUPA @ 22.30 dBm...
  • Page 82 LTE Standard Module Series WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB suspend) LTE-FDD PF = 256 (USB disconnected) WCDMA PF = 64 (USB disconnected) 16.7 WCDMA PF = 64 (USB connected) 32.2 Idle state LTE-FDD PF = 64 (USB disconnected)
  • Page 83 LTE Standard Module Series LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB suspend) LTE-FDD PF = 256 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) 14.0 Idle state LTE-FDD PF = 64 (USB connected) 32.6 LTE-FDD B2 @ 23.08 dBm LTE-FDD B4 @ 23.31 dBm LTE-FDD B5 @ 23.23 dBm LTE data...

  • Page 84: Rf Output Power

    Lost state @ Passive antenna Tracking Open sky @ Passive antenna (AT+CFUN=0) 6.5. RF Output Power The following table shows the RF output power of EG91 series module. Table 41: RF Output Power Frequency Bands Max. Output Power Min. Output Power GSM850 33 dBm ±2 dB...

  • Page 85: Rf Receiving Sensitivity

    In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 series module. Table 42: EG91-AUX Conducted RF Receiving Sensitivity Frequency Band...
  • Page 86 LTE Standard Module Series Table 43: EG91-E Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Band 3GPP (SIMO) Primary Diversity SIMO EGSM900 -108.6 dBm -102 dBm DCS1800 -109.4 dBm -102 dBm WCDMA B1 -109.5 dBm -110 dBm -112.5 dBm -106.7 dBm WCDMA B8 -109.5 dBm -110 dBm...
  • Page 87 LTE Standard Module Series LTE-FDD B7 (10 MHz) -97.5 dBm -98.4 dBm -100.3 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -98.7 dBm -99.6 dBm -102.2 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97 dBm -97.5 dBm -102.2 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.2 dBm -99.5 dBm...
  • Page 88 LTE Standard Module Series Table 47: EG91-NAX Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Band 3GPP (SIMO) Primary Diversity SIMO WCDMA B2 -110 dBm -110 dBm -112.5 dBm -104.7 dBm WCDMA B4 -110 dBm -110 dBm -112.5 dBm -106.7 dBm WCDMA B5 -111 dBm -111 dBm...

  • Page 89: Electrostatic Discharge

    LTE Standard Module Series LTE-FDD B25 (10 MHz) -97.6 dBm -99 dBm -102.2 dBm -92.8 dBm LTE-FDD B26 (10 MHz) -99.1 dBm -99.9 dBm -102.7 dBm -93.8 dBm Table 49: EG91-NAXDL Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Band 3GPP (SIMO) Primary Diversity...

  • Page 90: Thermal Consideration

    LTE Standard Module Series Table 51: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 All Antenna Interfaces ±4 ±8 Other Interfaces ±0.5 ±1 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration: ...
  • Page 91 LTE Standard Module Series Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTE The module offers the best performance when the internal BB chip stays below 105 °C. When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).
  • Page 92 LTE Standard Module Series For more details about thermal design, see document [7]. 91 / 105 EG91_Series_Hardware_Design...

  • Page 93: Mechanical Dimensions

    LTE Standard Module Series Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 25±0.15 2.30±0.2 Pin 1 Figure 41: Module Top and Side Dimensions 92 / 105...
  • Page 94 LTE Standard Module Series Pin 1 Figure 42: EG91-E Bottom Dimensions (Top View) 93 / 105 EG91_Series_Hardware_Design...
  • Page 95 LTE Standard Module Series Pin 1 Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom Dimensions (Top View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. 94 / 105 EG91_Series_Hardware_Design...

  • Page 96: Recommended Footprint

    LTE Standard Module Series 7.2. Recommended Footprint 7.45 7.15 1.10 1.95 1.10 0.50 0.50 Pin 1 4.85 1.00 5.10 1.70 0.20 0.85 1.10 1.90 5.95 4.25 1.10 0.85 1.00 1.00 1.70 0.70 1.70 2.75 0.50 0.55 1.15 0.50 1.70 62x0.7 40x1.0 1.70 1.70...

  • Page 97: Top And Bottom Views Of The Module

    LTE Standard Module Series 7.3. Top and Bottom Views of the Module Figure 45: Top View of the Module Figure 46: EG91-E Bottom View 96 / 105 EG91_Series_Hardware_Design...
  • Page 98 LTE Standard Module Series /-NAXDL Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD /-VX Bottom View NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. 97 / 105 EG91_Series_Hardware_Design...

  • Page 99: Storage, Manufacturing And Packaging

    LTE Standard Module Series Storage, Manufacturing and Packaging 8.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 100: Manufacturing And Soldering

    LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.

  • Page 101: Packaging

    [8]. 8.3. Packaging EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application.
  • Page 102 LTE Standard Module Series Figure 49: Tape Dimensions 48.5 Cover tape Direction of feed +0.20 44.5 -0.00 Figure 50: Reel Dimensions 101 / 105 EG91_Series_Hardware_Design...
  • Page 103 LTE Standard Module Series 1083 Carrier tape Carrier tape packing module unfolding Figure 51: Tape and Reel Directions 102 / 105 EG91_Series_Hardware_Design...

  • Page 104: Appendix References

    LTE Standard Module Series Appendix References Table 53: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_EC2x&EG9x_Power_Management_Application_Note [3] Quectel_EG9x_AT_Commands_Manual [4] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note [5] Quectel_EC2x&EG2x&EG9x&EM05_Series_QCFG_AT_Commands_Manual [6] Quectel_RF_Layout_Application_Note [7] Quectel_LTE_Module_Thermal_Design_Guide [8] Quectel_Module_Secondary_SMT_User_Guide Table 54: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter Adaptive Multi-rate Bits Per Second CHAP Challenge Handshake Authentication Protocol Coding Scheme...
  • Page 105 LTE Standard Module Series DC-HSPA+ Dual-carrier High Speed Packet Access Data Coding Scheme DFOTA Delta Firmware Upgrade Over-The-Air Downlink Data Terminal Ready Discontinuous Transmission EDGE Enhanced Data Rates for GSM Evolution Enhanced Full Rate EGSM Enhanced GSM Electrostatic Discharge Frequency Division Duplex Full Rate File Transfer Protocol FTPS...
  • Page 106 LTE Standard Module Series Inom Nominal Current Light Emitting Diode Land Grid Array Low Noise Amplifier Long Term Evolution Machine to Machine Mobile Equipment MIMO Multiple Input Multiple Output Mobile Originated Multimedia Messaging Service Mobile Station (GSM engine) Modulation and Coding Scheme MQTT Message Queuing Telemetry Transport Moisture Sensitivity Level...
  • Page 107 LTE Standard Module Series PING Packet Internet Groper PMIC Power Management IC Point of Sale Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circularly Polarized RoHS Restriction of Hazardous Substances Request to Send Receive Surface Acoustic Wave Serial Peripheral Interface...
  • Page 108 LTE Standard Module Series (U)SIM (Universal) Subscriber Identity Module Universal Serial Bus Vmax Maximum Voltage Vnom Nominal Voltage Vmin Minimum Voltage Maximum High-evel Input Voltage Minimum High-evel Input Voltage Maximum I Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage...

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