Packaging Process - Quectel EM160R-GL Hardware Design

6.5.2. Packaging Process

Each blister tray packs 15 modules. Stack
10 blister trays with modules together, and put
1 empty blister tray on the top.
Put the seal-packed blister trays into the mini box.
1 mini box can pack 150 modules.
EM160R-GL_Hardware_Design
Packing 11 blister trays together and then put
blister trays into conductive bag, seal and
pack the conductive bag.
Put 4 packaged mini boxes into 1 carton box
and then seal it. 1 carton box can pack
600 modules.
Figure 33: Packaging Process
LTE-A Module Series
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