Packaging Specifications; Carrier Tape - Quectel EC21 Series Hardware Design

Table 57: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 217 °C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Avoid using ultrasonic technology for module cleaning and soldering since it can damage crystals
inside the module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g. selective soldering) that is not
mentioned in document [9].

7.3. Packaging Specifications

The module adopts carrier tape packaging and details are as follow:

7.3.1. Carrier Tape

Dimension details are as follow:
EC21_Series_Hardware_Design
LTE Standard Module Series
Recommendation
1–3 °C/sec
70–120 s
2–3°C/s
40–70 s
235 °C to 246 °C
-1.5 to -3 °C/s
1
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