3.11. Configuration Pins ..................................................................................................................... 45
4
RF Specifications ............................................................................................................................... 47
4.1.
Cellular Network ........................................................................................................................ 47
4.1.1.
4.1.2.
Rx Sensitivity .................................................................................................................. 49
4.1.3.
Tx Power ........................................................................................................................ 51
4.2.
GNSS ...................................................................................................................................... 52
4.2.1.
4.2.2.
GNSS Performance ....................................................................................................... 53
4.3.
Antenna Connectors ................................................................................................................. 54
4.3.1.
4.3.2.
4.3.3.
4.4.
Antenna Requirements ............................................................................................................. 58
5
5.1.
Absolute Maximum Ratings ...................................................................................................... 59
5.2.
Power Supply Ratings ............................................................................................................... 59
5.3.
Digital I/O Characteristics ......................................................................................................... 60
5.4.
5.5.
Power Consumption .................................................................................................................. 61
5.6.
ESD Protection .......................................................................................................................... 64
5.7.
Thermal Dissipation .................................................................................................................. 65
5.8.
Notification ................................................................................................................................ 66
5.8.1.
Coating ........................................................................................................................... 66
5.8.2.
Cleaning ......................................................................................................................... 66
6
Mechanical Information ..................................................................................................................... 67
6.1.
Mechanical Dimensions ............................................................................................................ 67
6.2.
Top and Bottom Views .............................................................................................................. 68
6.3.
M.2 Connector ........................................................................................................................... 68
6.4.
Module Installation .................................................................................................................... 69
6.5.
Packaging Specifications .......................................................................................................... 70
6.5.1.
Blister Tray ..................................................................................................................... 70
6.5.2.
Packaging Process ........................................................................................................ 71
7
Appendix References ........................................................................................................................ 72
EM160R-GL_Hardware_Design
LTE-A Module Series
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