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12
Appendix
12.1
Mechanical overview
12.1.1
Server node interior
Figure 225: Server node interior (air cooling) (example: CX2560 M6)
1
Riser module on the left side
2
M.2 SSD (2x) (not visible, located
under the riser module)
3
Dual microSD 64GB Enterprise
4
Memory slots for CPU1 with air duct
5
CPU1 with heat sink
6
CPU2 with heat sink
7
Memory slots for CPU2 with air duct
8
CX2560 M6 dedicated internal RAID
module
9
10
11
12
13
14
15
Upgrade and Maintenance Manual
FBU
Memory slots for CPU2 with air duct
Memory slots for CPU1 with air duct
Air Durct
Intel VROC
Riser module on the right side
OCP module (not visible, located under
the riser module)
293
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