Soldering And Reflow Condition - Texas Instruments SimpleLink CC2652PSIP Manual

CC2652PSIP
SWRS263A – FEBRUARY 2021 – REVISED JUNE 2022

11.6 Soldering and Reflow Condition

• Heating method: Conventional convection or IR convection
• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent method
• Solder paste composition: SAC305
• Allowable reflow soldering times: 2 times based on the reflow soldering profile (see
• Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 11-1)
• Peak temperature: 260°C
Figure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder
Profile Elements
Peak temperature range
Pre-heat / soaking (150 to 200°C)
Time above melting point
Time with 5°C to peak
Ramp up
Ramp down
(1) For details, refer to the solder paste manufacturer's recommendation.
TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module.
This coating can lead to localized stress on the solder connections inside the module and impact
the module reliability. Use caution during the module assembly process to the final PCB to avoid the
presence of foreign material inside the module.
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Joint)
Table 11-1. Temperature Profile
235 to 240°C typical (260°C maximum)
60 to 120 seconds
60 to 90 seconds
30 seconds maximum
< 3°C / second
< -6°C / second
Note
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Figure 11-1)
(1)
Convection or IR
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