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Figure 36: Thermal Dissipation Area Inside and on Bottom Side of the Module (Unit: mm)
There are other measures to enhance heat dissipation performance:
⚫
Add as many ground vias as possible on PCB.
⚫
Maximize airflow over/around the module.
⚫
Place the module away from other heating sources.
⚫
Module mounting holes must be used to attach (ground) the device to the main PCB ground.
⚫
It is NOT recommended to apply solder mask on the main PCB where the module's thermal
dissipation area is located.
⚫
To facilitate the thermal dissipation, select an appropriate material with thickness and surface for the
outer housing (i.e. the mechanical enclosure) of the application device that integrates the module.
⚫
Use active cooling method when it is necessary to pull heat away from the module.
⚫
If possible, add a heatsink on the top of the module. In this case, A thermal pad should be used
between the heatsink and the module, and the heatsink should be designed with as many fins as
possible to increase the heat dissipation area.
NOTE
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
RM502Q-GL_Hardware_Design
5G Module Series
RM502Q-GL Hardware Design
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