Packaging - Infineon AIROC CYBLE-343072-02 Manual

AIROC™ Bluetooth® LE module

Packaging

19 Packaging
Table 24 Solder Reflow peak temperature
Module
part number
CYBLE-343072-02 43-pad SMT
CYBLE-333073-02 45-pad SMT
CYBLE-333074-02 43-pad SMT
Table 25 Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module part number
CYBLE-343072-02
CYBLE-333073-02
CYBLE-333074-02
The CYBLE-3x307x-02 is offered in tape and reel packaging.
CYBLE-3x307x-02.
Figure 20 CYBLE-3x307x-02 tape dimensions
Figure 21 details the orientation of the CYBLE-3x307x-02 in the tape as well as the direction for unreeling.
Figure 21 Component orientation in tape and unreeling direction
Preliminary Datasheet
Maximum peak
Package
temperature
260 °C
260 °C
260 °C
Maximum time at peak
temperature
Package
43-pad SMT
45-pad SMT
43-pad SMT
Figure 20 details the tape dimensions used for the
49 of 58
No. of cycles
30 seconds
30 seconds
30 seconds
MSL
MSL 3
MSL 3
MSL 3
002-33419 Rev. **
2
2
2
2021-07-22