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Please note that Cypress is an Infineon Technologies Company.
The document following this cover page is marked as "Cypress" document as this is the
company that originally developed the product. Please note that Infineon will continue
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Summary of Contents for Infineon Cypress EZ-BLE CYBLE-012011-00

  • Page 1 The document following this cover page is marked as “Cypress” document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio.
  • Page 2 CYBLE-012011-00 EZ-BLE™ Creator Module EZ-BLE™ Creator Module General Description Functional Capabilities Up to 22 capacitive sensors for buttons or sliders with  ■ The CYBLE-012011-00 is a Bluetooth Low Energy (BLE) best-in-class signal-to-noise ratio (SNR) and liquid tolerance wireless module solution. The CYBLE-012011-00 is a turnkey solution and includes onboard crystal oscillators, trace antenna, 12-bit, 1-Msps SAR ADC with internal reference, ■...
  • Page 3 CYBLE-012011-00 More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design. Overview: EZ-BLE Module Portfolio, Module Roadmap Knowledge Base Articles ■...
  • Page 4: Table Of Contents

    CYBLE-012011-00 Contents Overview ................4 Safety Certification ............ 29 Module Description ............4 Environmental Conditions ......... 29 Pad Connection Interface ..........6 ESD and EMI Protection ........... 29 Recommended Host PCB Layout ........7 Regulatory Information ..........30 Digital and Analog Capabilities FCC ................
  • Page 5: Overview

    CYBLE-012011-00 Overview Module Description The CYBLE-012011-00 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality.
  • Page 6 CYBLE-012011-00 Figure 1. Module Mechanical Drawing Top View Side View Bottom View Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see Figure Figure...
  • Page 7: Pad Connection Interface

    CYBLE-012011-00 Pad Connection Interface As shown in the bottom view of Figure 1 on page 5, the CYBLE-012011-00 connects to the host board via solder pads on the backside of the module. Table 2 Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-012011-00 module. Table 2.
  • Page 8: Recommended Host Pcb Layout

    CYBLE-012011-00 Recommended Host PCB Layout Figure Figure Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-012011-00. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length.
  • Page 9 CYBLE-012011-00 Table 3 provides the center location for each solder pad on the CYBLE-012011-00. All dimensions are referenced to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 6.
  • Page 10: Digital And Analog Capabilities And Connections

    CYBLE-012011-00 Digital and Analog Capabilities and Connections Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on CYBLE-012011-00, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each ✓...
  • Page 11: Power Supply Connections And Recommended External Components

    CYBLE-012011-00 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-012011-00 contains two power supply connections, In either connection scenario, it is recommended to place an VDD and VDDR. The VDD connection supplies power for both external ferrite bead between the supply and the module digital and analog device operation.
  • Page 12 CYBLE-012011-00 Figure 8. Recommended Host Schematic for an Independent Supply Option Independent Power Supply Option (Seen from Bottom) Document Number: 002-02521 Rev. *G Page 11 of 39 Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Downloaded from Downloaded from Downloaded from Downloaded from...
  • Page 13 CYBLE-012011-00 The CYBLE-012011-00 schematic is shown in Figure Figure 9. CYBLE-012011-00 Schematic Diagram Document Number: 002-02521 Rev. *G Page 12 of 39 Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Arrow.com. Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from Downloaded from...
  • Page 14: Critical Components List

    CYBLE-012011-00 Critical Components List Table 5 details the critical components used in the CYBLE-012011-00 module. Table 5. Critical Component List Component Reference Designator Description Silicon 56-pin QFN PSoC 4 BLE Crystal 24.000 MHz, 12PF Crystal 32.768 kHz, 12.5PF Antenna Design Table 6 details trace antenna used in the CYBLE-012011-00 module.
  • Page 15: Electrical Specification

    CYBLE-012011-00 Electrical Specification Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 7. CYBLE-012011-00 Absolute Maximum Ratings Parameter Description Units Details/Conditions Analog, digital, or radio supply relative to V –0.5 – Absolute maximum DDD_ABS Direct digital core voltage input relative to V –0.5 –...
  • Page 16 CYBLE-012011-00 Table 9. CYBLE-012011-00 DC Specifications (continued) Parameter Description Units Details/Conditions Execute from flash; CPU at 12 MHz – – – T = –40 °C to 85 °C T = 25 °C, Execute from flash; CPU at 24 MHz – –...
  • Page 17: Gpio

    CYBLE-012011-00 Table 10. AC Specifications Parameter Description Units Details/Conditions 1.71 V V 5.5 V CPU frequency – Wakeup from Sleep mode – – µs Guaranteed by characterization SLEEP 24-MHz IMO. Guaranteed by Wakeup from Deep-Sleep mode – – µs DEEPSLEEP characterization Wakeup from Hibernate mode –...
  • Page 18: Xres

    CYBLE-012011-00 Table 12. GPIO AC Specifications Parameter Description Units Details/Conditions Rise time in Fast-Strong mode – 3.3-V V = 25 pF RISEF LOAD Fall time in Fast-Strong mode – 3.3-V V = 25 pF FALLF LOAD Rise time in Slow-Strong mode –...
  • Page 19 CYBLE-012011-00 Table 16. XRES AC Specifications Parameter Description Units Details/Conditions Reset pulse width – – µs – RESETWIDTH Temperature Sensor Table 17. Temperature Sensor Specifications Parameter Description Units Details/Conditions Temperature-sensor accuracy –5 ±1 °C –40 to +85 °C SENSACC SAR ADC Table 18.
  • Page 20 CYBLE-012011-00 Table 19. SAR ADC AC Specifications (continued) Details/ Parameter Description Units Conditions A_INL Integral nonlinearity. V = 1.71 V to –1.5 – = 1 V to V 5.5 V, 500 ksps A_dnl Differential nonlinearity. V = 1.71 V to –1 –...
  • Page 21: Digital Peripherals

    CYBLE-012011-00 Digital Peripherals Timer Table 20. Timer DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – µA 16-bit timer TIM1 Block current consumption at 12 MHz – – µA 16-bit timer TIM2 Block current consumption at 48 MHz –...
  • Page 22 CYBLE-012011-00 Pulse Width Modulation (PWM) Table 24. PWM DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – µA 16-bit PWM PWM1 Block current consumption at 12 MHz – – µA 16-bit PWM PWM2 Block current consumption at 48 MHz –...
  • Page 23: Serial Communication

    CYBLE-012011-00 Serial Communication Table 28. Fixed I C DC Specifications Parameter Description Units Details/Conditions Block current consumption at 100 kHz – – µA – I2C1 Block current consumption at 400 kHz – – µA – I2C2 Block current consumption at 1 Mbps –...
  • Page 24: Memory

    CYBLE-012011-00 Table 35. Fixed SPI Slave Mode AC Specifications (continued) Parameter Description Units Details/Conditions Previous MISO data hold time – – SSEL valid to first SCK valid edge – – SSELSCK Memory Table 36. Flash DC Specifications Parameter Description Units Details/Conditions Erase and program voltage 1.71...
  • Page 25: System Resources

    CYBLE-012011-00 System Resources Power-on-Reset (POR) Table 38. POR DC Specifications Parameter Description Units Details/Conditions Rising trip voltage 0.80 – 1.45 – RISEIPOR Falling trip voltage 0.75 – 1.40 – FALLIPOR Hysteresis – – IPORHYST Table 39. POR AC Specifications Parameter Description Units Details/Conditions...
  • Page 26 CYBLE-012011-00 Table 43. Voltage Monitor AC Specifications Parameter Description Units Details/Conditions Voltage monitor trip time – – µs – MONTRIP SWD Interface Table 44. SWD Interface Specifications Parameter Description Units Details/Conditions 3.3 V  V  5.5 V SWDCLK 1/3 CPU clock frequency F_SWDCLK1 –...
  • Page 27 CYBLE-012011-00 BLE Subsystem Table 50. BLE Subsystem Details/ Parameter Description Units Conditions RF Receiver Specification RXS, IDLE RX sensitivity with idle transmitter – –89 – RX sensitivity with idle transmitter – –91 – Guaranteed by design excluding Balun loss simulation RXS, DIRTY RX sensitivity with dirty transmitter –...
  • Page 28 CYBLE-012011-00 Details/ Parameter Description Units Conditions RXSE2 Receiver spurious emission – – –47 1-MHz measurement 1.0 GHz to 12.75 GHz bandwidth ETSI EN300 328 V1.8.1 RF Transmitter Specifications TXP, ACC RF power accuracy – ±1 – TXP, RANGE RF power control range –...
  • Page 29 CYBLE-012011-00 Details/ Parameter Description Units Conditions ITX,-18dBm TX current at –18-dBm setting (PA1) – 12.5 – Iavg_1sec, 0dBm Average current at 1-second BLE – 17.1 – µA TXP: 0 dBm; ±20-ppm connection interval master and slave clock accuracy. For empty PDU exchange Iavg_4sec, 0dBm Average current at 4-second BLE –...
  • Page 30: Environmental Specifications

    CYBLE-012011-00 Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-012011-00 module will be certified under the following RF certification standards at production release.
  • Page 31: Regulatory Information

    CYBLE-012011-00 Regulatory Information FCC NOTICE: The device CYBLE-012011-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
  • Page 32: Ised

    CYBLE-012011-00 ISED Innovation, Science and Economic Development Canada (ISED) Certification CYBLE-012011-00 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada (ISED). License: IC: 7922A-2011 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
  • Page 33: Mic Japan

    CYBLE-012011-00 MIC Japan CYBLE-012011-00 is certified as a module with type certification number 203-JN0509. End products that integrate CYBLE-012011-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. KC Korea CYBLE-012011-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2011.
  • Page 34: Packaging

    CYBLE-012011-00 Packaging Table 52. Solder Reflow Peak Temperature Maximum Time at Peak Module Part Number Package Maximum Peak Temperature No. of Cycles Temperature CYBLE-012011-00 31-pad SMT 260 °C 30 seconds Table 53. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package CYBLE-012011-00 31-pad SMT...
  • Page 35 CYBLE-012011-00 Figure 12 details reel dimensions used for the CYBLE-012011-00. Figure 12. Reel Dimensions The CYBLE-012011-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-012011-00 is detailed in Figure Figure 13. CYBLE-012011-00 Center of Mass (Seen from Top) Document Number: 002-02521 Rev.
  • Page 36: Ordering Information

    CYBLE-012011-00 Ordering Information Table 54 lists the CYBLE-012011-00 part numbers and features.The CYBLE-012011-00 is available in certified and uncertified options.Table 55 lists the CYBLE-012011-00 reel shipment quantities. Table 54. Ordering Information Flash 12-Bit Part Number Speed Size CapSense SCB TCPWM LCD Package Packing Certified...
  • Page 37: Acronyms

    CYBLE-012011-00 Acronyms Acronym Description Bluetooth Low Energy Bluetooth SIG Bluetooth Special Interest Group European Conformity Canadian Standards Association electromagnetic interference electrostatic discharge Federal Communications Commission GPIO general-purpose input/output Industry Canada integrated design environment Korea Certification Ministry of Internal Affairs and Communications (Japan) printed circuit board receive QDID...
  • Page 38: Document History Page

    CYBLE-012011-00 Document History Page Document Title: CYBLE-012011-00, EZ-BLE™ Creator Module Document Number: 002-02521 Orig. of Submission Revision Description of Change Change Date 4998892 MINS 10/22/2015 Preliminary datasheet for CYBLE-012011-00 module. Updated General Description to add reference and link to PSoC 4 BLE silicon datasheet.
  • Page 39 CYBLE-012011-00 Document Title: CYBLE-012011-00, EZ-BLE™ Creator Module Document Number: 002-02521 Updated More Information: Added EZ-Serial™ BLE Firmware Platform section. Updated Overview: Updated Figure 1 to specify that Bottom View is “Seen from Bottom”. Updated Recommended Host PCB Layout: Updated Figure Figure 5, and Figure 6...
  • Page 40: Sales, Solutions, And Legal Information

    CYBLE-012011-00 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. ® Products PSoC Solutions ®...

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