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CYW20822-P4TAI040, CYW20822-P4EPI040
A I R O C ™ B l u etooth ® L E m o d u l e
General description
The CYW20822-P4xxI040 is a fully integrated Bluetooth® LE wireless module. The CYW20822-P4xxI040 includes an
onboard crystal oscillator, passive components, flash memory, and the CYW20822 silicon device.
The CYW20822-P4xxI040 supports peripheral functions (ADC and PWM), UART, I
a PDM interface. The CYW20822-P4xxI040 includes a royalty-free Bluetooth® stack compatible with Bluetooth®
5.0 core spec in a 20.2 × 10.5 × 2.3 mm package.
The CYW20822-P4xxI040 includes 1 MB of embedded flash memory and is pre-loaded with EZ-Serial firmware.
The CYW20822-P4xxI040 is fully qualified by Bluetooth® SIG and is targeted at applications requiring
cost-optimized Bluetooth® wireless connectivity.
The CYW20822-P4xxI040 is offered in two certified versions: CYW20822-P4TAI040 and CYW20822-P4EPI040. The
CYW20822-P4TAI040 includes an integrated trace antenna. The CYW20822-P4EPI040 supports an external
antenna through a RF solder pad output.
Module descri pti on
• Module size: 20.2 × 10.5 × 2.3 mm
• Bluetooth® 5.0 core spec qualified module
- Declaration ID: TBD
• Certified to FCC, ISED, MIC, and CE regulations
• Castelated solder pad connections for ease-of-use
• 1-MB embedded on-module serial flash memory
• Up to 12 GPIOs
• Temperature range: –45°C to +85°C
• 16-MHz Arm® Cortex®-M0 microcontroller unit MCU
• Maximum TX output power
- +4 dBm for Bluetooth® Low Energy
• Bluetooth® LE connection range of up to 250 meters at 4 dBm
• RX sensitivity:
- Bluetooth® Low Energy: –101 dBm @ 125 kbps
Powe r consu mpti on
• Bluetooth® LE current consumption
- RX current: 1.3 mA @ -95 dBm
- TX current: 3 mA @ 0 dBm
- Retention: 2 µA @ 32 KB RAM
- Hibernation: 0.8 µA
Note
1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or
interference sources with output power of +4 dBM @ 125 kbps. Actual range will vary based on end product
design, environment, receive sensitivity, and transmit output power of the central device.
Preliminary Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
[1]
page 1
2
C, and SPI communication, and
002-38449 Rev. **
2023-08-21
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Table of Contents
Related Manuals for Infineon AIROC CYW20822-P4TAI040
Summary of Contents for Infineon AIROC CYW20822-P4TAI040
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Page 1: General Description
+4 dBM @ 125 kbps. Actual range will vary based on end product design, environment, receive sensitivity, and transmit output power of the central device. Preliminary Datasheet Please read the Important Notice and Warnings at the end of this document 002-38449 Rev. ** www.infineon.com page 1 2023-08-21... -
Page 2: Functional Capabilities
• Fully certified module eliminates the time needed for design, development, and certification processes • Pre-loaded EZ-Serial firmware provides an easy-to-use command interface to configure and use the module More information Infineon provides a wealth of data at www.infineon.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design. -
Page 3: Technical Support
Infineon community: Whether you are a customer, partner, or a developer interested in the latest innovations, the developer community offers you a place to learn, share, and engage with both Infineon experts and other embedded engineers around the world. • Visit our... -
Page 4: Table Of Contents
AIROC™ Bluetooth® LE module Table of contents Table of contents General description ...........................1 Module description..........................1 Power consumption...........................1 Functional capabilities........................2 Benefits............................2 More information ..........................2 References............................2 Technical support..........................3 Table of contents ..........................4 1 Overview ............................5 1.1 Functional block diagram............................5 1.2 Module description ..............................5 1.2.1 Module dimensions and drawing........................5 2 Pad connection interface.........................7 3 Recommended host PCB layout......................9... -
Page 5: Overview
1.2.1 Module dimensions and drawing Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 2. - Page 6 AIROC™ Bluetooth® LE module Overview Figure 2 for the mechanical reference drawing for CYW20822-P4xxI040. Figure 2 Module mechanical drawing Preliminary Datasheet 002-38449 Rev. ** 2023-08-21...
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Page 7: Pad Connection Interface
AIROC™ Bluetooth® LE module Pad connection interface Pad connection interface As shown in the bottom view of Figure 2, the CYW20822-P4xxI040 connects to the host board via solder pads on the backside of the module. Table 2 Figure 3 detail the solder pad length, width, and pitch dimensions of the CYW20822-P4xxI040 module. - Page 8 AIROC™ Bluetooth® LE module Pad connection interface Figure 4 Recommended host PCB keepout area around the CYW20822-P4xxI040 antenna Preliminary Datasheet 002-38449 Rev. ** 2023-08-21...
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Page 9: Recommended Host Pcb Layout
AIROC™ Bluetooth® LE module Recommended host PCB layout Recommended host PCB layout Figure Figure Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYW20822-P4xxI040. Dimensions are in millimeters unless otherwise noted. Pad length of 1.26 mm (0.64 mm from center of the pad on either side) shown in Figure 4 is the minimum recommended host... - Page 10 AIROC™ Bluetooth® LE module Recommended host PCB layout Table 3 provides the center location for each solder pad on the CYW20822-P4xxI040. All dimensions are refer- enced to the center of the solder pad. Refer to Figure 7 for the location of each module solder pad. Table 3 Module solder pad location Solder pad...
- Page 11 AIROC™ Bluetooth® LE module Recommended host PCB layout Figure 7 Solder pad reference location Preliminary Datasheet 002-38449 Rev. ** 2023-08-21...
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Page 12: Functional Description
AIROC™ Bluetooth® LE module Functional description Functional description The CYW20822-P4XXI040 module is based on the CYW20822 SoC, which includes a Bluetooth® 5 solution and an RF wakeup receiver. The block diagram of the CYW20822-P4XXI040 module is shown in Figure Figure 8 Module block diagram Power management The power management unit provides I/O power supplies to the CYW20822 module. PMU generates power supply outputs: VDDIOP, and an auxiliary supply VAUX used internally by the PMU (refer to Table Table 4 PMU external pins... -
Page 13: Pmu Configurations
AIROC™ Bluetooth® LE module Functional description 4.1.1 PMU configurations Configure the PMU correctly to ensure correct operation. The following modes of operation are supported by the PMU: • One external power supply or battery with external I/O supply: • For applications that cannot support fixed 1.8 V I/O supply (see Figure - Connect VBATT to VDDIO - Connect VAUX to VDDIOP... -
Page 14: Pin Assignments
AIROC™ Bluetooth® LE module Pin assignments Pin assignments CYW20822-P4XXI040 module pinout Figure 11 Module pin definition Table 5 Pin type definitions Pin type Definition Signal input output Radio frequency Power supply Analog No connection, must be open Ground Preliminary Datasheet 002-38449 Rev. - Page 15 AIROC™ Bluetooth® LE module Pin assignments Table 6 CYW20822-P4XXI040 module pin description Pin Number Name Type Description Ground reference WURX Wakeup receiver RF input VBATT Battery supply Programmable Digital I/O ADC Input The default definition is UART0_CTS. Programmable Digital I/O ADC Input The default definition is SPIO_CS.
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Page 16: Electrical Characteristics
AIROC™ Bluetooth® LE module Electrical characteristics Electrical characteristics Table 7 Maximum electrical ratings Parameter Description Unit Battery supply –0.2 – BATT I/O supply –0.2 – DDIO I/O pin –0.2 – Storage temperature –40 – °C STORE Table 8 Recommended operating conditions Parameter Description Unit... -
Page 17: Pcb Antenna Performance
AIROC™ Bluetooth® LE module PCB antenna performance PCB antenna performance Trace antenna specifications Item Description Frequency range 2400-2500MHz Peak gain 4.21-dBi typical Return loss 10-dB minimum Trace antenna performance Figure 12 CYW20822-P4XXI040 PCB antenna radiation pattern and characteristics Preliminary Datasheet 002-38449 Rev. -
Page 18: Environmental Specifications
Environmental specifications Environmental compliance This CYW20822-P4xxI040 Bluetooth® LE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Infineon module and components used to produce this module are RoHS and HF compliant. RF certification The CYW20822-P4xxI040 module will be certified under the following RF certification standards at production release. -
Page 19: Regulatory Information
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: TBD. -
Page 20: Ised
AIROC™ Bluetooth® LE module Regulatory information RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antenna in Table 7, to alert users on FCC RF Exposure compliance. -
Page 21: European Declaration Of Conformity
The Original Equipment Manufacturer (OEM) must ensure that ISED labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon IC identifier for this product as well as the ISED Notices above. The IC identifier is TBD. In any case, the end product must be labeled in its exterior with “Contains IC: TBD“... -
Page 22: Mic Japan
AIROC™ Bluetooth® LE module Regulatory information MIC Japan CYW20822-P4xxI040 is certified as a module (certification number TBD). End products that integrate CYW20822-P4xxI040 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Figure 13 MIC label Preliminary Datasheet... -
Page 23: Packaging
AIROC™ Bluetooth® LE module Packaging Packaging Table 12 Solder Reflow peak temperature Module part Maximum peak Maximum time at peak Package No. of cycles number temperature temperature CYW20822-P4TAI040 27-pad SMT 260°C 30 seconds CYW20822-P4EPI040 27-pad SMT 260°C 30 seconds Table 13 Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module part number Package... - Page 24 AIROC™ Bluetooth® LE module Packaging Figure 16 details reel dimensions used for the CYW20822-P4xxI040. Figure 16 Reel dimensions Preliminary Datasheet 002-38449 Rev. ** 2023-08-21...
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Page 25: Ordering Information
The CYW20822-P4xxI040 is offered in tape and reel packaging. The CYW20822-P4xxI040 ships in a reel size of 500. For additional information and a complete list of Infineon Wireless products, contact your local Infineon sales representative. To locate the nearest Infineon office, visit our website. -
Page 26: Acronyms
AIROC™ Bluetooth® LE module Acronyms Acronyms Table 16 Acronyms used in this document Acronym Description analog-to-digital converter advertising arithmetic logic unit AMUXBUS analog multiplexer bus application programming interface Arm® advanced RISC machine, a CPU architecture Bluetooth® Low Energy Bluetooth® SIG Bluetooth®... - Page 27 AIROC™ Bluetooth® LE module Acronyms Table 16 Acronyms used in this document (continued) Acronym Description infinite impulse response, see also FIR internal low-speed oscillator, see also IMO internal main oscillator, see also ILO integral nonlinearity, see also DNL IPOR initial power-on reset IPSR interrupt program status register interrupt request...
- Page 28 AIROC™ Bluetooth® LE module Acronyms Table 16 Acronyms used in this document (continued) Acronym Description PRES precise power-on reset pseudo random sequence port read data register PSoC® Programmable System-on-Chip™ PSRR power supply rejection ratio pulse-width modulator QDID qualification design ID random-access memory RISC reduced-instruction-set computing...
- Page 29 AIROC™ Bluetooth® LE module Acronyms Table 16 Acronyms used in this document (continued) Acronym Description UART Universal Asynchronous Transmitter Receiver, a communications protocol universal digital block Universal Serial Bus USBIO USB input/output, PSoC pins used to connect to a USB port VDAC voltage DAC, see also DAC, IDAC watchdog timer...
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Page 30: Document Conventions
AIROC™ Bluetooth® LE module Document conventions Document conventions 13.1 Units of measure Table 17 Units of measure Symbol Unit of measure °C degrees Celsius decibel decibel-milliwatts femtofarads hertz 1024 bytes kbps kilobits per second kilohour kilohertz k kilo ohm ksps kilosamples per second least significant bit Mbps... -
Page 31: Revision History
AIROC™ Bluetooth® LE module Revision history Revision histor y Document Date Description of changes revision 2023-08-21 New datasheet. Preliminary Datasheet 002-38449 Rev. ** 2023-08-21... - Page 32 All referenced product or service names and trademarks are the property of their respective owners. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc., and any use of such marks by Infineon is under license.