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CYBLE-343072-02, CYBLE-333073-02,
CYBLE-333074-02
A I R O C ™ B l u etooth ® L E m o d u l e
General description
The CYBLE-3x307x-02 is a fully integrated Bluetooth® smart ready wireless module. The CYBLE-3x307x-02
includes an onboard crystal oscillator, passive components, flash memory, and the CYW20835 silicon device.
Refer to the
CYW20835
module.
The CYBLE-3x307x-02 supports peripheral functions (ADC and PWM), UART, I
2
PCM/I
S audio interface. The CYBLE-3x307x-02 includes a royalty-free Bluetooth® stack compatible with
Bluetooth® 5.0 in a 13.31 × 21.89 × 1.95 mm package.
The CYBLE-3x307x-02 includes 512 KB of onboard serial flash memory and is designed for standalone operation.
The CYBLE-3x307x-02 uses an integrated power amplifier to achieve Class I or Class II output power capability.
The CYBLE-3x307x-02 is fully qualified by Bluetooth® SIG and is targeted at applications requiring cost-optimized
Bluetooth® wireless connectivity.
The CYBLE-3x307x-02 is offered in four certified versions CYBLE-343072-02, CYBLE-333073-02, and
CYBLE-333074-02. The CYBLE-343072-02 includes an integrated trace antenna. The CYBLE-333073-02 supports
an external antenna through a RF solder pad output. The CYBLE-333074-02 supports an external antenna via a
u-FL connector.
Module descri pti on
• Module size: 13.31 × 21.89 × 1.95 mm
• Bluetooth® 5.0 Qualified Smart Ready module
- QDID: TBD
- Declaration ID: TBD
• Certified to FCC, ISED, MIC, and CE regulations
• Castelated solder pad connections for ease-of-use
• 512-KB on-module serial flash memory
• Up to 24 GPIOs
• Temperature range: –30 °C to +85 °C
• Cortex-M4 32-bit processor
• Maximum TX output power
- +12 dBm for Bluetooth® Low Energy
• Bluetooth® LE connection range of up to 250 meters at 12 dBm
• RX receive sensitivity:
- Bluetooth® Low Energy: –94.5 dBm
Powe r consu mpti on
• Bluetooth® LE Current Consumption
- RX current: 8 mA
- TX current: 18 mA @ 12 dBm
- Interval Bluetooth® LE ADV average current consumption: 30 µA
- HIDOFF (Deep Sleep): 1 µA
Functional capabilities
• 1x MIPI DMI-C interface
• 6x 16-bit PWMs
• Programmable key-scan matrix interface, up to 8 × 20 key scanning matrix
Preliminary Datasheet
www.infineon.com
datasheet for additional details on the capabilities of the silicon device used in this
Please read the Important Notice and Warnings at the end of this document
[1]
page 1 of 58
2
C, and SPI communication, and a
002-33419 Rev. **
2021-07-22
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Related Manuals for Infineon AIROC CYBLE-343072-02
Summary of Contents for Infineon AIROC CYBLE-343072-02
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Page 1: General Description
• 6x 16-bit PWMs • Programmable key-scan matrix interface, up to 8 × 20 key scanning matrix Preliminary Datasheet Please read the Important Notice and Warnings at the end of this document 002-33419 Rev. ** www.infineon.com page 1 of 58 2021-07-22... -
Page 2: Benefits
• ModusToolbox™ provides an easy-to-use integrated design environment (IDE) to configure, develop, and program a Bluetooth® application More information Infineon provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design. -
Page 3: Development Environments
Cypress community: Whether you are a customer, partner, or a developer interested in the latest innovations, the developer community offers you a place to learn, share, and engage with both Infineon experts and other embedded engineers around the world. •... -
Page 4: Table Of Contents
AIROC™ Bluetooth® LE module Contents Contents General description ...........................1 Module description..........................1 Power consumption...........................1 Functional capabilities........................1 Benefits............................2 More information ..........................2 References............................2 Development environments .......................3 Technical support..........................3 Contents............................4 1 Overview ............................6 1.1 Functional block diagram............................6 1.2 Module description ..............................6 1.2.1 Module dimensions and drawing........................6 2 Pad connection interface.........................8 3 Recommended host PCB layout......................10 4 Module connections ........................14... - Page 5 AIROC™ Bluetooth® LE module Contents 8.8 Security engine ..............................27 9 Keyboard scanner .........................29 9.1 Theory of operation ..............................29 9.1.1 Idle ..................................29 9.1.2 Scan ..................................29 9.1.3 Scan End................................29 9.2 Mouse quadrature signal decoder ........................29 9.3 Theory of operation ..............................30 9.4 ADC port ................................30 10 Clock frequencies........................31 11 GPIO port ...........................32 12 PWM............................33...
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Page 6: Overview
1.2.1 Module dimensions and drawing Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in... - Page 7 AIROC™ Bluetooth® LE module Overview Figure 2 for the mechanical reference drawing for CYBLE-3x307x-02. Figure 2 Module mechanical drawing Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended host PCB layout”...
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Page 8: Pad Connection Interface
AIROC™ Bluetooth® LE module Pad connection interface Pad connection interface As shown in the bottom view of Figure 2 on page 7, the CYBLE-3x307x-02 connects to the host board via solder pads on the backside of the module. Table 2 Figure 3 detail the solder pad length, width, and pitch dimen- sions of the CYBLE-3x307x-02 module. - Page 9 AIROC™ Bluetooth® LE module Pad connection interface Figure 4 Recommended host PCB keepout area around the CYBLE-3x307x-02 antenna Preliminary Datasheet 9 of 58 002-33419 Rev. ** 2021-07-22...
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Page 10: Recommended Host Pcb Layout
AIROC™ Bluetooth® LE module Recommended host PCB layout Recommended host PCB layout Figure Figure Figure , and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-3x307x-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.26 mm (0.64 mm from center of the pad on either side) shown in Figure 4 is the minimum recommended host pad length. - Page 11 AIROC™ Bluetooth® LE module Recommended host PCB layout Figure 6 CYBLE-3x307x-02 host layout (relative to origin) Table 3 provides the center location for each solder pad on the CYBLE-3x307x-02. All dimensions are referenced to the center of the solder pad. Refer to Figure 7 for the location of each module solder pad.
- Page 12 AIROC™ Bluetooth® LE module Recommended host PCB layout Table 3 Module solder pad location (continued) Solder pad Location (X,Y) from Dimension from (center of pad) origin (mm) origin (mils) (2.15, 21.51) (84.65, 846.85) (3.05, 21.51) (120.08, 846.85) (3.95, 21.51) (155.51, 846.85) (4.85, 21.51) (190.94, 846.85) (5.75, 21.51)
- Page 13 AIROC™ Bluetooth® LE module Recommended host PCB layout Figure 7 Solder pad reference location Preliminary Datasheet 13 of 58 002-33419 Rev. ** 2021-07-22...
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Page 14: Module Connections
AIROC™ Bluetooth® LE module Module connections Module connections Table 4 details the solder pad connection definitions and available functions for the pad connections for the CYBLE-3x307x-02 module. Table 4 lists the solder pads on the CYBLE-3x307x-02 module, the silicon device pin, and denotes what functions are available for each solder pad. - Page 15 AIROC™ Bluetooth® LE module Module connections Table 4 Pin assignments (continued) Module pad Power Silicon pin name Description name number domain HOST_WAKE BT_HOST_WAKE VDDO Host wake-up. This is a signal from the Bluetooth® device to the host indicating that the Bluetooth® device requires attention.
- Page 16 AIROC™ Bluetooth® LE module Module connections Table 5 GPIO pin descriptions (continued) Module Silicon Direction Power Default alternate function description number Default state domain name name Input Floating VDDO GPIO: P10 A/D converter input 25 Input Floating VDDO GPIO: P11 A/D converter input 24 Input Floating...
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Page 17: Connections And Optional External Components
AIROC™ Bluetooth® LE module Connections and optional external components Connections and optional external components Power connections (VDDIN) The CYBLE-3x307x-02 contains one power supply connection, VDDIN, which accepts a supply input range of 2.5 V to 3.6 V for CYBLE-3x307x-02. Table 12 provides this specification. - Page 18 AIROC™ Bluetooth® LE module Connections and optional external components • If the XRES connection of the CYBLE-3x307x-02 module is not used in the application, a 10-µF capacitor may be connected to the XRES solder pad of the CYBLE-3x307x-02 to delay the XRES release. The capacitor value for this recommended implementation is approximate, and the exact value may differ depending on the VDDIN power supply ramp time of the system.
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Page 19: Critical Components List
AIROC™ Bluetooth® LE module Connections and optional external components Figure 9 illustrates the CYBLE-3x307x-02 schematic. Figure 9 CYBLE-3x307x-02 schematic diagram Critical components list Table 6 details the critical components used in the CYBLE-3x307x-02 module. Table 6 Critical component list Component Reference designator description Silicon... -
Page 20: Antenna Design
AIROC™ Bluetooth® LE module Connections and optional external components Antenna design Table 7 details trace antenna used in the CYBLE-3x307x-02 module. For more information, see Table Table 7 Trace antenna specifications Item Description Frequency range 2400–2500 MHz Peak gain –0.5-dBi typical Return loss 10-dB minimum Preliminary Datasheet... -
Page 21: Functional Description
AIROC™ Bluetooth® LE module Functional description Functional description Bluetooth® baseband core The Bluetooth® baseband core (BBC) implements all of the time-critical functions required for high-performance Bluetooth® LE 5.0 operation. The BBC manages the buffering, segmentation, and routing of data for all connec- tions. -
Page 22: Test Mode Support
AIROC™ Bluetooth® LE module Functional description 6.1.2 Test mode support The CYBLE-3x307x-02 fully supports the Bluetooth® Test mode as described in Part I:1 of the Specification of the Bluetooth® System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. -
Page 23: Power-On Reset (Por)
AIROC™ Bluetooth® LE module Functional description • File system information used for code, code patches, or data. The CYW20835 uses SPI Serial Flash for NVRAM storage. 6.2.4 Power-on reset (POR) The CYW20835 includes POR logic to allow the part to initialize correctly when power is applied. Figure 10 shows the sequence used by the CYW20835 during initialization. -
Page 24: Integrated Radio Transceiver
AIROC™ Bluetooth® LE module Integrated radio transceiver Integrated radio transceiver The CYBLE-3x307x-02 has an integrated radio transceiver that has been optimized for use in 2.4-GHz Bluetooth® wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4-GHz unlicensed ISM band. -
Page 25: Peripheral And Communication Interfaces
AIROC™ Bluetooth® LE module Peripheral and communication interfaces Peripheral and communication interfaces C communication interface The CYBLE-3x307x-02 provides a 2-pin master I C interface, which can be used to retrieve configuration infor- mation from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. -
Page 26: Triac Control
AIROC™ Bluetooth® LE module Peripheral and communication interfaces Table 9 Common baud rate examples, 24 MHz clock (continued) Baud rate adjustment Baud rate (bps) Mode Error (%) High nibble Low nibble 115200 0x00 0x00 Normal 0.16 57600 0x00 0x00 Normal 0.16 38400 0x01... -
Page 27: Infrared Modulator
AIROC™ Bluetooth® LE module Peripheral and communication interfaces SPI master device that supports 1.8 V or 3.3 V SPI slaves. The CYBLE-3x307x-02 can also act as an SPI slave device that supports a 1.8 V or 3.3 V SPI master. Note SPI voltage depends on VDDO/VDDM;... - Page 28 AIROC™ Bluetooth® LE module Peripheral and communication interfaces • RSA encryption and decryption of modulus sizes up to 2048 bits • Elliptic curve Diffie-Hellman in prime field GF(p) • Generic modular math functions Preliminary Datasheet 28 of 58 002-33419 Rev. ** 2021-07-22...
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Page 29: Keyboard Scanner
AIROC™ Bluetooth® LE module Keyboard scanner Keyboard scanner The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host microcontroller to intervene. The scanner has the following features: • Ability to turn off its clock if no keys are pressed. •... -
Page 30: Theory Of Operation
AIROC™ Bluetooth® LE module Keyboard scanner - For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1. - For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1. - For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1. -
Page 31: Clock Frequencies
AIROC™ Bluetooth® LE module Clock frequencies Clock frequencies The CYBLE-3x307x-02 has an integrated 24-MHz crystal on the module. There is no need to add an additional crystal oscillator. Preliminary Datasheet 31 of 58 002-33419 Rev. ** 2021-07-22... -
Page 32: Gpio Port
AIROC™ Bluetooth® LE module GPIO port GPIO port GPIO ports for this device is shown in Table 4-2. The CYBLE-3x307x-02 uses 24 general-purpose I/Os (GPIOs). All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3 V or 4 mA at 1.8 V, except P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3 V or 8 mA at 1.8 V. -
Page 33: Pwm
AIROC™ Bluetooth® LE module The CYBLE-3x307x-02 has four PWMs. The PWM module consists of the following: • PWM0-5. Each of the six PWM channels contains the following registers: - 16-bit initial value register (read/write) - 16-bit toggle register (read/write) - 16-bit PWM counter value register (read) •... -
Page 34: Power Management Unit
AIROC™ Bluetooth® LE module Power management unit Power management unit The Power management unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. 13.1 RF power management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4-GHz transceiver, which then processes the power-down functions accordingly. -
Page 35: Electrical Characteristics
AIROC™ Bluetooth® LE module Electrical characteristics Electrical characteristics Table 11 shows the maximum electrical rating for voltages referenced to V pad. DDIN Table 11 Maximum electrical rating Rating Symbol Value Unit – 3.795 DDIN Voltage on input or output pin –... -
Page 36: Chipset Rf Specifications
AIROC™ Bluetooth® LE module Chipset RF specifications Chipset RF specifications All specifications in Table 15 are for industrial temperatures and are single-ended. Unused inputs are left open. Table 15 Receiver RF Specifications Parameter Conditions Unit General Frequency range – 2402 –... - Page 37 AIROC™ Bluetooth® LE module Chipset RF specifications Table 16 Transmitter RF Specifications (TBD) Parameter Conditions Unit General Frequency range – 2402 – 2480 Class 1: GFSK TX power – – – Power control step – Out-of-Band Spurious Emissions [12] 30 MHz to 1 GHz –...
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Page 38: Timing And Ac Characteristics
AIROC™ Bluetooth® LE module Timing and AC characteristics Timing and AC characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. 16.1 UART timing Table 18 UART timing specifications Reference Characteristics Unit... -
Page 39: Spi Timing
AIROC™ Bluetooth® LE module Timing and AC characteristics 16.2 SPI timing The SPI interface supports clock speeds up to 12 MHz Table 19 Figure 14 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively. - Page 40 AIROC™ Bluetooth® LE module Timing and AC characteristics Table 20 Figure 15 show the timing requirements when operating in SPI Mode 1 and 3. Table 20 SPI mode 1 and 3 Reference Characteristics Unit Time from master assert SPI_CSN to first clock edge –...
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Page 41: I2C Interface Timing
AIROC™ Bluetooth® LE module Timing and AC characteristics 16.3 C interface timing Table 21 C Interface Timing Specifications Reference Characteristics Unit Clock frequency – 1000 START condition setup time – START condition hold time – Clock low time – Clock high time –... - Page 42 AIROC™ Bluetooth® LE module Timing and AC characteristics Table 22 Timing for I S transmitters and receivers Transmitter Receiver Lower limit Upper limit Lower limit Upper limit Notes Clock Period T – – – – – – Master mode: Clock generated by transmitter or receiver HIGH t 0.35T –...
- Page 43 AIROC™ Bluetooth® LE module Timing and AC characteristics Figure 17 S transmitter timing Figure 18 S receiver timing Preliminary Datasheet 43 of 58 002-33419 Rev. ** 2021-07-22...
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Page 44: Environmental Specifications
17.1 Environmental compliance This CYBLE-3x307x-02 Bluetooth® LE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Infineon module and components used to produce this module are RoHS and HF compliant. 17.2 RF certification The CYBLE-3x307x-02 module will be certified under the following RF certification standards at production release. -
Page 45: Regulatory Information
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP3072. -
Page 46: Ised
AIROC™ Bluetooth® LE module Regulatory information RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antenna in Table 7, to alert users on FCC RF Exposure compliance. -
Page 47: European Declaration Of Conformity
The Original Equipment Manufacturer (OEM) must ensure that ISED labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon IC identifier for this product as well as the ISED Notices above. The IC identifier is TBD. In any case, the end product must be labeled in its exterior with “Contains IC: TBD“... -
Page 48: Mic Japan
AIROC™ Bluetooth® LE module Regulatory information 18.4 MIC Japan CYBLE-3x307x-02 is certified as a module with certification number 203-JNxxxx. End products that integrate CYBLE-3x307x-02 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Figure 19 MIC label Preliminary Datasheet... -
Page 49: Packaging
AIROC™ Bluetooth® LE module Packaging Packaging Table 24 Solder Reflow peak temperature Module Maximum peak Maximum time at peak Package No. of cycles part number temperature temperature CYBLE-343072-02 43-pad SMT 260 °C 30 seconds CYBLE-333073-02 45-pad SMT 260 °C 30 seconds CYBLE-333074-02 43-pad SMT 260 °C... - Page 50 AIROC™ Bluetooth® LE module Packaging Figure 22 details reel dimensions used for the CYBLE-3x307x-02. Figure 22 Reel dimensions The CYBLE-3x307x-02 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-3x307x-02 is detailed in Figure Figure 23 CYBLE-3x307x-02 center of mass...
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Page 51: Ordering Information
The CYBLE-3x307x-02 is offered in tape and reel packaging. The CYBLE-3x307x-02 ships in a reel size of 500. For additional information and a complete list of Infineon Wireless products, contact your local Infineon sales representative. To locate the nearest Infineon office, visit our website. -
Page 52: Acronyms
AIROC™ Bluetooth® LE module Acronyms Acronyms Table 28 Acronyms used in this document Acronym Description analog-to-digital converter advertising arithmetic logic unit AMUXBUS analog multiplexer bus application programming interface Arm® advanced RISC machine, a CPU architecture Bluetooth® Low Energy Bluetooth® SIG Bluetooth® Special Interest Group bandwidth Controller Area Network, a communications protocol European Conformity... - Page 53 AIROC™ Bluetooth® LE module Acronyms Table 28 Acronyms used in this document (continued) Acronym Description internal low-speed oscillator, see also IMO internal main oscillator, see also ILO integral nonlinearity, see also DNL IPOR initial power-on reset IPSR interrupt program status register interrupt request instrumentation trace macrocell Korea Certification...
- Page 54 AIROC™ Bluetooth® LE module Acronyms Table 28 Acronyms used in this document (continued) Acronym Description pseudo random sequence port read data register PSoC® Programmable System-on-Chip™ PSRR power supply rejection ratio pulse-width modulator QDID qualification design ID random-access memory RISC reduced-instruction-set computing root-mean-square real-time clock register transfer language...
- Page 55 AIROC™ Bluetooth® LE module Acronyms Table 28 Acronyms used in this document (continued) Acronym Description universal digital block Universal Serial Bus USBIO USB input/output, PSoC pins used to connect to a USB port VDAC voltage DAC, see also DAC, IDAC watchdog timer write once latch, see also NVL WRES...
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Page 56: Document Conventions
AIROC™ Bluetooth® LE module Document conventions Document conventions 22.1 Units of measure Table 29 Units of measure Symbol Unit of Measure °C degrees Celsius decibel decibel-milliwatts femtofarads hertz 1024 bytes kbps kilobits per second kilohour kilohertz k kilo ohm ksps kilosamples per second least significant bit Mbps... -
Page 57: Revision History
AIROC™ Bluetooth® LE module Revision History Revision History Document Date of release Description of changes version 2021-07-22 Initial release Preliminary Datasheet 57 of 58 002-33419 Rev. ** 2021-07-22... - Page 58 Infineon Technologies AG With respect to any examples, hints or any typical 81726 Munich, Germany values stated herein and/or any information WARNINGS regarding the application of the product, Infineon Due to technical requirements products may contain Technologies hereby disclaims dangerous substances. For information on the types...