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AIROC™ Bluetooth® LE module
Overview
1
Overview
1.1
Functional block diagram
Figure 1
illustrates the CYBLE-3x307x-02 functional block diagram.
UART
PCM/12S
ADC
UP to 6 PWMs
UP to 24 GPIOs
32kHz LPO_In
(Optional)
1x MIPI DMI‐C
interface
Figure 1
Functional block diagram (GPIOs)
1.2
Module description
The CYBLE-3x307x-02 module is a complete module designed to be soldered to the application's main board.
1.2.1
Module dimensions and drawing
Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module
functionality. Such selections will still guarantee that all mechanical specifications and module certifications are
maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in
2 on page
7. All dimensions are in millimeters (mm).
Table 1
Module design dimensions
Module dimensions
Antenna connection location dimensions
PCB thickness
Shield height
Maximum component height
Total module thickness (bottom of module to highest
component)
Preliminary Datasheet
XRES
SPI
12C
Passive Components
(RES, CAP, IND)
Dimension item
CYW20835
Silicon Device
512 KB
SERIAL FLASH
Length (X)
13.31 ± 0.15 mm
Width (Y)
21.89 ± 0.15 mm
Length (X)
13.31 mm
Width (Y)
4.65 mm
Height (H)
0.50 ± 0.05 mm
Height (H)
1.45-mm typical
Height (H)
1.45-mm typical
Height (H)
1.95-mm typical
6 of 58
24 MHz
XTAL
Figure
Specification
002-33419 Rev. **
2021-07-22
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