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AIROC™ Bluetooth® LE module
Recommended host PCB layout
Figure 6
CYBLE-3x307x-02 host layout (relative to origin)
Table 3
provides the center location for each solder pad on the CYBLE-3x307x-02. All dimensions are referenced
to the center of the solder pad. Refer to
Table 3
Module solder pad location
Solder pad
(center of pad)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Preliminary Datasheet
Figure 7
for the location of each module solder pad.
Location (X,Y) from
origin (mm)
(0.38, 7.21)
(0.38, 8.12)
(0.38, 9.02)
(0.38, 9.92)
(0.38, 10.82)
(0.38, 11.72)
(0.38, 12.62)
(0.38, 13.53)
(0.38, 14.43)
(0.38, 15.33)
(0.38, 16.23)
(0.38, 17.13)
(0.38, 18.03)
(0.38, 18.94)
(0.38, 19.84)
(1.24, 21.51)
11 of 58
Dimension from
origin (mils)
(14.96, 283.86)
(14.96, 319.68)
(14.96, 355.12)
(14.96, 390.55)
(14.96, 425.98)
(14.96, 461.42)
(14.96, 496.85)
(14.96, 532.68)
(14.96, 568.11)
(14.96, 603.54)
(14.96, 638.54)
(14.96, 674.41)
(14.96, 709.84)
(14.96, 745.67)
(14.96, 781.10)
(48.82, 846.85)
002-33419 Rev. **
2021-07-22
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