Packaging - Infineon AIROC CYW20822-P4TAI040 Manual

AIROC™ Bluetooth® LE module

Packaging

10 Packaging
Table 12 Solder Reflow peak temperature
Module part
Package
number
CYW20822-P4TAI040 27-pad SMT 260°C
CYW20822-P4EPI040 27-pad SMT 260°C
Table 13 Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module part number
CYW20822-P4TAI040
CYW20822-P4EPI040
The CYW20822-P4xxI040 is offered in tape and reel packaging.
CYW20822-P4xxI040.
Figure 14 CYW20822-P4xxI040 tape dimensions
Figure 15 details the orientation of the CYW20822-P4xxI040 in the tape as well as the direction for unreeling.
Figure 15 Component orientation in tape and unreeling direction
Preliminary Datasheet
Maximum peak Maximum time at peak
temperature temperature
30 seconds
30 seconds
Package
27-pad SMT
27-pad SMT
23
MSL
MSL 3
MSL 3
Figure 14 details the tape dimensions used for the
No. of cycles
2
2
002-38449 Rev. **
2023-08-21