Infineon AIROC CYBLE-343072-02 Manual page 12

AIROC™ Bluetooth® LE module
Recommended host PCB layout
Table 3 Module solder pad location
Solder pad
(center of pad)
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
Preliminary Datasheet
(continued)
Location (X,Y) from
origin (mm)
(2.15, 21.51)
(3.05, 21.51)
(3.95, 21.51)
(4.85, 21.51)
(5.75, 21.51)
(6.65, 21.51)
(7.56, 21.51)
(8.46, 21.51)
(9.36, 21.51)
(10.26, 21.51)
(11.16, 21.51)
(12.07, 21.51)
(12.93, 19.84)
(12.93, 18.94)
(12.93, 18.03)
(12.93, 17.13)
(12.93, 16.23)
(12.93, 15.33)
(12.93, 14.43)
(12.93, 13.53)
(12.93, 12.62)
(12.93, 11.72)
(12.93, 10.82)
(12.93, 9.92)
(12.93, 9.02)
(12.93, 8.12)
(12.93, 7.21)
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Dimension from
origin (mils)
(84.65, 846.85)
(120.08, 846.85)
(155.51, 846.85)
(190.94, 846.85)
(226.38, 846.85)
(261.81, 846.85)
(297.64, 846.85)
(333.07, 846.85)
(368.50, 846.85)
(403.94, 846.85)
(439.37, 846.85)
(475.20, 846.85)
(509.05, 781.10)
(509.05, 745.67)
(509.05, 709.84)
(509.05, 674.41)
(509.05, 638.98)
(509.05, 603.54)
(509.05, 568.11)
(509.05, 532.68)
(509.05, 496.85)
(509.05, 461.42)
(509.05, 425.98)
(509.05, 390.55)
(509.05, 355.12)
(509.05, 319.68)
(509.05, 283.86)
002-33419 Rev. **
2021-07-22