Infineon AIROC CYW20829B0-P4 I100 Series Manual

Bluetooth le module

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CYW20829B0-P4TAI100, CYW20829B0-P4EPI100,

CYW20829B0S-P4TAI100, CYW20829B0S-P4EPI100

A I R O C ™ B l u etooth ® L E m o d u l e

General description

The CYW20829B0-P4xxI100 is a fully integrated Bluetooth® LE wireless module. The CYW20829B0-P4xxI100

includes an onboard crystal oscillator, passive components, flash memory, and the CYW20829 silicon device.

Refer to the

CYW20829

module.

The CYW20829B0-P4xxI100 supports high-performance analog-to-digital conversion audio input, I

LIN for automotive use cases and other standard communication and timing peripherals. The

CYW20829B0-P4xxI100 includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.4 core spec in a

14.5 × 19 × 1.95 mm package.

The CYW20829B0-P4xxI100 includes 1 MB of onboard serial flash memory and is designed for standalone

operation. The CYW20829B0-P4xxI100 uses an integrated power amplifier to achieve Class I or Class II output

power capability.

The CYW20829B0-P4xxI100 is fully qualified by Bluetooth® SIG and is targeted at applications requiring

cost-optimized Bluetooth® wireless connectivity.

The CYW20829B0-P4xxI100 is offered in two certified versions CYW20829B0-P4TAI100, and

CYW20829B0-P4EPI100. The CYW20829B0-P4TAI100 includes an integrated trace antenna. The

CYW20829B0-P4EPI100 supports an external antenna through a RF solder pad output.

Module descri pti on

• Module size: 14.5 × 19 × 1.95 mm

• Bluetooth® 5.4 core spec qualified module

- QDID: TBD

- Declaration ID: TBD

• Certified to FCC, ISED, MIC, and CE regulations

• Castelated solder pad connections for ease-of-use

• 1-MB on-module serial flash memory

• Up to 26 GPIOs

• Temperature range: –30°C to +85°C

• 96-MHz Arm® Cortex®-M33 CPU with single-cycle multiply and memory protection unit (MPU)

• Maximum TX output power

- Programmable TX power: up to 11 dBm

• Bluetooth® LE connection range of up to 500 meters at 10 dBm

• RX sensitivity:

- LE-1 Mbps: –98 dBm

- LE-2 Mbps: –95 dBm

- Coded PHY 500 kbps (LE-LR): –101 dBm

- Coded PHY 125 kbps (LE-LR): –106 dBm

Note

1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interference

sources with output power of +10.0 dBm. Actual range will vary based on end product design, environment,

receive sensitivity, and transmit output power of the central device.

Datasheet

www.infineon.com

datasheet for additional details on the capabilities of the silicon device used in this

Please read the Important Notice and Warnings at the end of this document

[1]

page 1

S/PCM, CAN,

002-39262 Rev. **

2023-12-20

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Summary of Contents for Infineon AIROC CYW20829B0-P4 I100 Series

Page 1 +10.0 dBm. Actual range will vary based on end product design, environment, receive sensitivity, and transmit output power of the central device. Datasheet Please read the Important Notice and Warnings at the end of this document 002-39262 Rev. ** www.infineon.com page 1 2023-12-20...
Page 2 AIROC™ Bluetooth® LE module Power consumption Powe r consumpt ion • Bluetooth® LE current consumption - RX current: 5.6 mA @ LE 1 Mbps - TX current: 5.2 mA @ 0 dBm - Deep Sleep mode current with 64 KB SRAM retention: 4.5 µA - HIDOFF (Deep Sleep): 0.5 µA Functio nal capabilities •...
Page 3 AIROC™ Bluetooth® LE module Benefits • Security built into platform architecture - ROM-based root of trust via uninterruptible “Secure Boot” - Step-wise authentication of execution images - Secure execution of code in execute-only mode for protected routines - All debug and test ingress paths can be disabled - Up to four protection contexts (One available for customer code) - Secure debug support via authenticated debug token - Encrypted image support for external SMIF memory...
Page 4 Infineon community: Whether you are a customer, partner, or a developer interested in the latest innovations, the developer community offers you a place to learn, share, and engage with both Infineon experts and other embedded engineers around the world. • Visit our...
Page 5 AIROC™ Bluetooth® LE module Table of contents Table of contents General description ...........................1 Module description..........................1 Power consumption...........................2 Functional capabilities........................2 Benefits............................3 More information ..........................4 References............................4 Development environments .......................4 Technical support..........................4 Table of contents ..........................5 1 Overview ............................7 1.1 Functional block diagram............................7 1.2 Module description ..............................7 1.2.1 Module dimensions and drawing........................7 2 Pad connection interface.........................9...
Page 6 AIROC™ Bluetooth® LE module Table of contents 7.3.1 Sigma delta ADC..............................28 7.4 Programmable digital............................28 7.5 Fixed-function digital............................29 7.5.1 Timer/counter/pulse-width modulator (TCPWM) block..................29 7.5.2 Serial communication blocks (SCB)........................30 7.5.3 QSPI interface serial memory interface (SMIF)....................30 7.6 GPIO..................................31 7.7 Special-function peripherals..........................32 7.7.1 Audio subsystem..............................32 8 Pinouts ............................33 9 Power management unit .......................38 9.1 RF power management ............................38...
Page 7 1.2.1 Module dimensions and drawing Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 2.
Page 8 AIROC™ Bluetooth® LE module Overview Figure 2 for the mechanical reference drawing for CYW20829B0-P4xxI100. Figure 2 Module mechanical drawing Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended host PCB layout”...
Page 9 AIROC™ Bluetooth® LE module Pad connection interface Pad connection interface As shown in the bottom view of Figure 2, the CYW20829B0-P4xxI100 connects to the host board via solder pads on the backside of the module. Table 2 Figure 3 detail the solder pad length, width, and pitch dimensions of the CYW20829B0-P4xxI100 module.
Page 10 AIROC™ Bluetooth® LE module Pad connection interface Figure 4 Recommended host PCB keepout area around the CYW20829B0-P4xxI100 antenna Datasheet 002-39262 Rev. ** 2023-12-20...
Page 11 AIROC™ Bluetooth® LE module Recommended host PCB layout Recommended host PCB layout Figure 5 provides details that can be used for the recommended host PCB layout pattern for the CYW20829B0-P4xxI100. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.64 mm from center of the pad on either side) shown in Figure 4 is the minimum recommended host pad length.
Page 12 AIROC™ Bluetooth® LE module Module connections Module connections Table 3 details the solder pad connection definitions and available functions for the pad connections for the CYW20829B0-P4xxI100 module. Table 3 lists the solder pads on the CYW20829B0-P4xxI100 module, the silicon device pin, and denotes what functions are available for each solder pad. Table 3 Pin assignments Power...
Page 13 AIROC™ Bluetooth® LE module Module connections Table 4 GPIO pin descriptions Silicon Module Silicon Direction Power POR state Description pad name number pin name Default domain number P0.0 P0.0 Floating VDDO P0.1 P0.1 Floating VDDO P0.2 P0.2 Floating VDDO P0.3 P0.3 Floating VDDO...
Page 14 AIROC™ Bluetooth® LE module Connections and optional external components Connections and optional external components Power connections (VBAT) The CYW20829B0-P4xxI100 contains one power supply connection, VBAT, which accepts a supply input range of 2.75 V to 3.6 V for CYW20829B0-P4xxI100. Table 15 provides this specification.
Page 15 AIROC™ Bluetooth® LE module Connections and optional external components External reset (XRES) The CYW20829B0-P4xxI100 has an integrated power-on reset circuit, which completely resets all circuits to a known power-on state. This action can also be evoked by an external reset signal, forcing it into a power-on reset state.
Page 16 AIROC™ Bluetooth® LE module Connections and optional external components Figure 7 illustrates the CYW20829B0-P4xxI100 schematic. Figure 7 CYW20829B0-P4xxI100 schematic diagram Datasheet 002-39262 Rev. ** 2023-12-20...
Page 17 AIROC™ Bluetooth® LE module Connections and optional external components Critical components list Table 5 details the critical components used in the CYW20829B0-P4xxI100 module. Table 5 Critical component list Component Reference designator Description Silicon 56-pin QFN Bluetooth® LE silicon device - CYW20829 Silicon 8-pin TDF8N, 1 MB Serial Flash Crystal...
Page 18 • Hardware Abstraction Layer (HAL) API reference manual The Infineon HAL provides a high-level interface to configure and use hardware blocks on Infineon MCUs. It is a generic interface that can be used across multiple product families. You can leverage the HAL’s simpler and more generic interface for most of an application, even if one portion requires finer-grained control.
Page 19 AIROC™ Bluetooth® LE module Functional description 6.1.1 The Cortex®-M33 has single-cycle multiply and a memory protection unit (MPU). It can run at up to 96 MHz in LP mode and 48 MHz in ULP mode. This is the main CPU, designed for a short interrupt response time, high code density, and high throughput.
Page 20 AIROC™ Bluetooth® LE module Functional description 6.1.4 Cryptography accelerator (Cryptolite) A combination of HW and SW is able to support several cryptographic functions. Specifically it supports the following functions: • Encryption/decryption - AES-128 hardware accelerator with following supported modes: • Electronic Code Book (ECB) •...
Page 21 ‘0’ to ‘1’. To program an eFuse, VDDIO1 must be at 2.5 V ± 5%. Because blowing an eFuse is an irreversible process, programming is recommended only in mass production under controlled factory conditions by Infineon provided provisioning tools. 6.1.12 Boot code On a device reset, the boot code in ROM is the first code to execute.
Page 22 AIROC™ Bluetooth® LE module Functional description 6.1.13 Memory map The 32-bit (4 GB) address space is divided into the regions shown in Table 9. Note that code can be executed from the Code, and Internal RAM or External flash. Table 8 Address map Address range Name...
Page 23 AIROC™ Bluetooth® LE module System resources System resources Power system The power system provides assurance that voltage levels are as required for each respective mode and will either delay mode entry (on power-on reset (POR), for example) until voltage levels are as required for proper function or generate resets (brown-out detect (BOD)) when the power supply drops below specified levels.
Page 24 AIROC™ Bluetooth® LE module System resources 7.1.2 CYW20829 clock system CYW20829 clock system consists of a combination of oscillators, external clock, and frequency-locked loop. Specifically, the following: • Internal main oscillator (IMO) • Internal low-speed oscillator (ILO) • Watch crystal oscillator (WCO) •...
Page 25 AIROC™ Bluetooth® LE module System resources 7.1.3 Internal main oscillator (IMO) The IMO is the primary source of internal clocking. It is trimmed during testing to achieve the specified accuracy. The IMO default frequency is 8 MHz and tolerance is ±2%. 7.1.4 Internal low-speed oscillator (ILO) The ILO is a very low power oscillator, nominally 32 kHz, which operates in all power modes.
Page 26 AIROC™ Bluetooth® LE module System resources 7.1.5 External crystal oscillators (ECO) Figure 9 shows all of the external crystal oscillator circuits for CYW20829. The component values shown are typical; check the ECO specifications for the crystal values, and the crystal datasheet for the load capacitor values.
Page 27 AIROC™ Bluetooth® LE module System resources 7.1.9 Reset CYW20829 can be reset from a variety of sources: • Power-on reset (POR) to hold the device in reset while the power supply ramps up to the level required for the device to function properly. POR activates automatically at power-up. •...
Page 28 AIROC™ Bluetooth® LE module System resources Bluetooth® LE radio and subsystem CYW20829 incorporates a Bluetooth® 5.4 LE subsystem (BLESS) that contains the physical layer (PHY) and link layer (LL) engines with an embedded security engine. The Bluetooth® LE SS supports all Bluetooth® LE 5.4 features including LE 2 Mbps, LE Long Range, LE Advertising Extensions, LE Isochronous Channels, Periodic Advertising with Responses (PAwR), Encrypted Advertising Data, LE GATT Security Levels Characteristic and Advertising Coding Selection.
Page 29 AIROC™ Bluetooth® LE module System resources Fixed-function digital 7.5.1 Timer/counter/pulse-width modulator (TCPWM) block • The TCPWM supports the following operational modes: - Timer-counter with compare - Timer-counter with capture - Quadrature decoding - Pulse width modulation (PWM) - Pseudo-random PWM - PWM with dead time •...
Page 30 AIROC™ Bluetooth® LE module System resources 7.5.2 Serial communication blocks (SCB) • This product line has three SCBs: - First SCB: Configurable as SPI or I - Second SCB: Configurable as SPI or UART - Third SCB: Configurable as I C or UART •...
Page 31 AIROC™ Bluetooth® LE module System resources GPIO CYW20829 has up to 32 GPIOs, which implement: • Eight drive strength modes: - Analog input mode (input and output buffers disabled) on some IOs - Input only - Weak pull-up with strong pull-down - Strong pull-up with weak pull-down - Open drain with strong pull-down - Open drain with strong pull-up...
Page 32 AIROC™ Bluetooth® LE module System resources Special-function peripherals 7.7.1 Audio subsystem This subsystem consists of the following hardware blocks: • One inter-IC sound (I S) interface • Two pulse-density modulation (PDM) to pulse-code modulation (PCM) decoder channels The I S interface implements two independent hardware FIFO buffers - TX and RX, which can operate in master or slave mode.
Page 33 Each port pin has multiple alternate functions. These are defined in Table Table 13 Multiple alternate functions Port/Pin Analog ACT #0 ACT #1 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15...
Page 34 (continued) Table 13 Multiple alternate functions Port/Pin Analog ACT #0 ACT #1 ACT #4 ACT #5 ACT #6 ACT #7 ACT #8 ACT #9 ACT #10 ACT #11 ACT #12 ACT #13 ACT #14 ACT #15 DS #2 DS #3 DS #5 DS #6 DS #7...
Page 35 AIROC™ Bluetooth® LE module Power management unit Power management unit The Power management unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. RF power management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4-GHz transceiver, which then processes the power-down functions accordingly.
Page 36 AIROC™ Bluetooth® LE module Electrical characteristics Electrical characteristics Table 14 shows the maximum electrical ratings for voltages referenced to V pad. DDIN Table 14 Maximum electrical ratings Rating Symbol Value Unit – 3.795 DDIN Voltage on input or output pin –...
Page 37 AIROC™ Bluetooth® LE module Chipset RF specifications Chipset RF specifications All specifications in Table 18 are for industrial temperatures and are single-ended. Unused inputs are left open. Table 18 Receiver RF specifications Parameter Conditions Unit General Frequency range – 2402 –...
Page 38 AIROC™ Bluetooth® LE module Chipset RF specifications Table 19 Transmitter RF specifications Parameter Conditions Unit General Frequency range – 2402 – 2480 Class 1: GFSK TX power – – – Power control step – Out-of-Band spurious emissions [13] 30 MHz to 1 GHz –...
Page 39 AIROC™ Bluetooth® LE module Timing and AC characteristics Timing and AC characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. 12.1 UART timing Table 21 UART timing specifications Reference Characteristics Unit...
Page 40 AIROC™ Bluetooth® LE module Timing and AC characteristics 12.2 SPI timing The SPI interface supports clock speeds up to 12 MHz. Table 22 Figure 13 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively. Table 22 SPI mode 0 and 2 Reference...
Page 41 AIROC™ Bluetooth® LE module Timing and AC characteristics Table 23 Figure 14 show the timing requirements when operating in SPI Mode 1 and 3. Table 23 SPI mode 1 and 3 Reference Characteristics Unit Time from master assert SPI_CSN to first clock edge –...
Page 42 AIROC™ Bluetooth® LE module Timing and AC characteristics 12.3 C interface timing Table 24 C interface timing specifications Reference Characteristics Unit Clock frequency – 1000 START condition setup time – START condition hold time – Clock low time – Clock high time –...
Page 43 AIROC™ Bluetooth® LE module Timing and AC characteristics Table 25 Timing for I S transmitters and receivers Transmitter Receiver Lower limit Upper limit Lower limit Upper limit Notes Clock Period T – – – – – – Master mode: Clock generated by transmitter or receiver HIGH t 0.35 ×...
Page 44 AIROC™ Bluetooth® LE module Timing and AC characteristics Figure 16 S transmitter timing Figure 17 S receiver timing Datasheet 002-39262 Rev. ** 2023-12-20...
Page 45 13.1 Environmental compliance This CYW20829B0-P4xxI100 Bluetooth® LE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Infineon module and components used to produce this module are RoHS and HF compliant. 13.2 RF certification The CYW20829B0-P4xxI100 module will be certified under the following RF certification standards at production release.
Page 46 The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP829I10.
Page 47 AIROC™ Bluetooth® LE module Regulatory information RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antenna in Table 6, to alert users on FCC RF Exposure compliance.
Page 48 The Original Equipment Manufacturer (OEM) must ensure that ISED labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon IC identifier for this product as well as the ISED Notices above. The IC identifier is 7922A-829I10. In any case, the end product must be labeled in its exterior with “Contains IC: 7922A-829I10”...
Page 49 AIROC™ Bluetooth® LE module Regulatory information 14.4 MIC Japan CYW20829B0-P4xxI100 is certified as a module with certification number TBD. End products that integrate CYW20829B0-P4xxI100 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Figure 18 MIC label Datasheet...
Page 50 AIROC™ Bluetooth® LE module Packaging Packaging Table 27 Solder Reflow peak temperature Maximum peak Maximum time at peak Module part number Package No. of cycles temperature temperature CYW20829B0-P4TAI040 41-pad SMT 260°C 30 seconds CYW20829B0-P4EPI040 41-pad SMT 260°C 30 seconds Table 28 Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module part number Package...
Page 51 AIROC™ Bluetooth® LE module Packaging Figure 21 details reel dimensions used for the CYW20829B0-P4xxI100. Figure 21 Reel dimensions Datasheet 002-39262 Rev. ** 2023-12-20...
Page 52 The CYW20829B0-P4xxI100 is offered in tape and reel packaging. The CYW20829B0-P4xxI100 ships in a reel size of 500. For additional information and a complete list of Infineon Wireless products, contact your local Infineon sales representative. To locate the nearest Infineon office, visit our website.
Page 53 AIROC™ Bluetooth® LE module Acronyms Acronyms Table 31 Acronyms used in this document Acronym Description analog-to-digital converter advertising arithmetic logic unit AMUXBUS analog multiplexer bus application programming interface Arm® advanced RISC machine, a CPU architecture Bluetooth® Low Energy Bluetooth® SIG Bluetooth®...
Page 54 AIROC™ Bluetooth® LE module Acronyms Table 31 Acronyms used in this document (continued) Acronym Description infinite impulse response, see also FIR internal low-speed oscillator, see also IMO internal main oscillator, see also ILO integral nonlinearity, see also DNL IPOR initial power-on reset IPSR interrupt program status register interrupt request...
Page 55 AIROC™ Bluetooth® LE module Acronyms Table 31 Acronyms used in this document (continued) Acronym Description PRES precise power-on reset pseudo random sequence port read data register PSoC® Programmable System-on-Chip™ PSRR power supply rejection ratio pulse-width modulator QDID qualification design ID random-access memory RISC reduced-instruction-set computing...
Page 56 AIROC™ Bluetooth® LE module Acronyms Table 31 Acronyms used in this document (continued) Acronym Description UART Universal Asynchronous Transmitter Receiver, a communications protocol universal digital block Universal Serial Bus USBIO USB input/output, PSoC pins used to connect to a USB port VDAC voltage DAC, see also DAC, IDAC watchdog timer...
Page 57 AIROC™ Bluetooth® LE module Document conventions Document conventions 18.1 Units of measure Table 32 Units of measure Symbol Unit of measure °C degrees Celsius decibel decibel-milliwatts femtofarads hertz 1024 bytes kbps kilobits per second kilohour kilohertz k kilo ohm ksps kilosamples per second least significant bit Mbps...
Page 58 AIROC™ Bluetooth® LE module Revision history Revision histor y Document Date of release Description of changes version 2023-12-20 Initial release. Datasheet 002-39262 Rev. ** 2023-12-20...
Page 59 For information on the types Published by characteristics (“Beschaffenheitsgarantie”). in question please contact your nearest Infineon Technologies office. With respect to any examples, hints or any typical Infineon Technologies AG...

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