DIGITAL-LOGIC MICROSPACE MSM800SEV Technical User's Manual page 79

DIGITAL-LOGIC AG
Mother Board Device Configuration
The Mother Board Device configuration contains the only sub menu system of the setup screens. The
choices are
Drive Configuration: Allows the configuration of the IDE drive
-
I/O Configuration: Allows for the configuration of the serial ports on the CS5535/CS5536
-
LPC card devices: Allows for the configuration of the serial and parallel ports on an LPC Card
-
Video and Flat Panel Configuration: Allows for the configuration of flat panels and video memory
-
PCI Configuration: Allows for the configuration of PCI devices (IRQ,USB)
-
Thermal Configuration: Allows for the configuration of the Thermal limits.
-
Memory and Cache Optimizations
The Memory and Cache Optimizations screen should not be left in a shipping system. Miss configuring the
memory can render the system unable to boot. If the system is configured incorrectly, it may be necessary to
short CMOS to get the system to boot.
Cache Enable: Allows the configuration of the Cache of the system to be either Enabled or Disabled
Cache Mode: Allows the selection of the Cache mode either Write-Back or Write-Through
DIMM 0 or 1:
Memory Optimization DIMM 0 or 1: Allows the memory to be configured by Auto or Manual. If Auto
is selected DIMM Page Size, DIMM Size, DIMM Module Banks, and DIMM Component Banks will be
grayed out.
DIMM 0 or 1 Page Size: Allows selections of Not Installed, 1,2 ,4 ,8,16 KB
DIMM 0 or 1 Size: Allows for the configuration of the Memory size to be 8M, 16M,
32M,64M 128M, 256M, 512M
Module Banks: Allows for the configuration of the number of module banks. Options are 1
DIMM Component Banks: Allows for the configuration of the component banks Options 2
CAS Latency (SDR/DDR): Allows the configuration Column Address Select latency. The options are
Auto, 2CLK/1.5CLK, 3CLK/2CLK, 4CLK/ 2.5CLK, 5CLK/3CLK and 6CLK/NA
DDR/SDR: Allows the selection of the memory type options include Auto, DDR and SDR
Refresh rate: Allows the setting of the memory refresh rate. Options include: auto, 3us, 7us, 15us,
31us, 62us and 125us
Interleave selection: Allows the setting of the interleaving to either LOI (Low Order Interleaving) to
HOI (High Order Interleaving)
XOR MB0, BA0 or BA1: Allows the enable or disable of the XORing of module bank BA1or BA0
with upper GLIU address bit. Options are Enable and Disable.
Memory Latencies: Allows the manual or auto configuration of the memory latencies
ACT2PRE: ACT to PRE Period (tRAS). Minimum number of clocks from the ACT to PRE
commands on the same component bank
or 2
or 4
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MSM800 SEV Manual V1.0A