Oracle SPARC T5-1B Service Manual page 96

Transfer Components to the New Enclosure Assembly
1. Prepare to take all ESD precautions when working with both the original server
module and the new enclosure assembly.
Prepare to place all components on an antistatic mat unless you install each component
immediately in the new enclosure assembly.
Follow the precautions explained in
2. Remove the top cover from the original server module and the new enclosure
assembly.
See "Remove the Cover" on page
Transfer the drives and driver fillers from the original server module to the
3.
enclosure assembly.
See "Servicing Drives" on page
4. Transfer the FEM (if present) from the original server module to the enclosure
assembly.
Install the FEM in the same connectors in the enclosure assembly. See
FEM" on page
5. Transfer the SP card from the original server module to the enclosure assembly.
See "Servicing the SP Card" on page
Transfer the ID PROM from the original server module to the enclosure
6.
assembly.
See "Servicing the ID PROM" on page
7. Transfer the USB drive (if present) from the original server module to the
enclosure assembly.
Ensure that you install a USB drive only in the top slot of the connector. See
USB Drive" on page
8. (If needed) Transfer the battery to the enclosure assembly.
If a battery is present in the new enclosure assembly, do not transfer the original battery.
See "Servicing the Battery" on page
9. Transfer the DIMMs from the original server module to the enclosure assembly.
Move each DIMM to the same slot in the enclosure assembly. See
DIMMs" on page
Attach the original cover to the enclosure assembly.
10.
96 SPARC T5-1B Server Module Service Manual • February 2019
"Preparing for Service" on page
51.
53.
73.
77.
87.
91.
63.
81.
39.
"Servicing the
"Servicing the
"Servicing