Pos : 17.9 /All e Seri en ( Allgemei ne Module)/Ü bers chriften/N eue Ü berschriften/Ebene 2Anschl üss e - Ü berschrift 2 @ 4\mod_1240984262656_21.doc x @ 31961 @ 2 @ 1

3.2

Connectors

Pos : 17.10 /Serie 750 ( WAGO-I/O-SYST EM)/Gerätebeschr eibung/Ansc hlüss e/D atenkontakte/Kl emmenbus - Übersc hrift 3 @ 6\mod_1256294684083_21.doc x @ 43660 @ 3 @ 1

3.2.1

Data Contacts/Internal Bus

Pos : 17.11.1 /Serie 750 ( WAGO-I/O- SYST EM)/Gerätebeschr eibung/Ansc hlüss e/D atenkontakte - Fel dbus koppl er/-contr oller, Abbil dung und Bes chr eibung @ 3\mod_1231771259187_21.doc x @ 26002 @ @ 1

Communication between the fieldbus coupler/controller and the I/O modules as

well as the system supply of the I/O modules is carried out via the internal bus. It

is comprised of 6 data contacts, which are available as self-cleaning gold spring

contacts.

Figure 2: Data Contacts

Pos : 17.11.2 /Serie 750 ( WAGO-I/O- SYST EM)/Wic htig e Erl äuter ung en/Sic her hei ts- und s onstige Hi nweise/Ac htung/Ac htung: Bus kl emmen nicht auf Gol dfeder kontakte l egen! @ 7\mod_1266318463636_21.doc x @ 50695 @ @ 1

Do not place the I/O modules on the gold spring contacts!

Do not place the I/O modules on the gold spring contacts in order to avoid soiling

or scratching!

Pos : 17.11.3 /Serie 750 ( WAGO-I/O- SYST EM)/Wic htig e Erl äuter ung en/Sic her hei ts- und s onstige Hi nweise/Ac htung/Ac htung: ESD - Auf gute Er dung der U mgebung ac hten! @ 7\mod_1266318538667_21.doc x @ 50708 @ @ 1

Ensure that the environment is well grounded!

The devices are equipped with electronic components that may be destroyed by

electrostatic discharge. When handling the devices, ensure that the environment

(persons, workplace and packing) is well grounded. Avoid touching conductive

components, e.g. data contacts.

Pos : 17.12 /D okumentati on allgemei n/Gli ederungsel emente/---Seitenwec hs el--- @ 3\mod_1221108045078_0.doc x @ 21810 @ @ 1

WAGO-I/O-SYSTEM 750

750-451 8 AI RTD

Manual

Version 1.1.0

Table of Contents