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STM32L151xC STM32L152xC
7.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Figure 48. Thermal resistance suffix 6
Figure 49. Thermal resistance suffix 7
DocID022799 Rev 10
Package characteristics
129/135
134
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