Table 71. Wlcsp63, 0.400 Mm Pitch Wafer Level Chip Size Package Mechanical Data - STMicroelectronics STM32L151CCT6 Manual

Package characteristics

Table 71. WLCSP63, 0.400 mm pitch wafer level chip size package mechanical data

Symbol
A
A1
A2
A3
Øb
D
E
e
e1
e2
F
G
aaa
bbb
ccc
ddd
eee
1. Values in inches are converted from mm and rounded to 4 decimal digits.
126/135
millimeters
Min Typ
0.540 0.570
- 0.190
- 0.380
- 0.025
0.240 0.270
3.193 3.228
4.129 4.164
- 0.400
- 2.400
- 3.200
- 0.414
- 0.482
- -
- -
- -
- -
- -
DocID022799 Rev 10
STM32L151xC STM32L152xC
Max Min
0.600 0.0213
- -
- -
- -
0.300 0.0094
3.263 0.1257
4.199 0.1626
- -
- -
- -
- -
-
0.100 -
0.100 -
0.100 -
0.050 -
0.050 -
(1)
inches
Typ Max
0.0224 0.0236
0.0075 -
0.0150 -
0.0010 -
0.0106 0.0118
0.1271 0.1285
0.1639 0.1653
0.0157 -
0.0945 -
0.1260 -
0.0163 -
0.0190 -
- 0.0039
- 0.0039
- 0.0039
- 0.0020
- 0.0020