Operating Environment; Environmental Temperature Sensor; Nonoperating Environment; Cooling - HP 9000 rp3410 User's & Service Manual

System Specifications
Environmental Specifications
Table 2-6 Environmental Specifications (Continued)
Parameter
Maximum configuration (disk active)
Rack system
Typical configuration (disk idle)
Maximum configuration (disk idle)
Maximum configuration (disk active)
Operating altitude
Storage altitude
a. Typical configuration at room temperature (25°C).
b. One processor enabled, one or two SCSI hard disk drives and less than 8 GB of memory.
c. Two dual processors, one or two SCSI hard disk drives and less than 8 GB of memory.

Operating Environment

The system is designed to run continuously and meet reliability goals in an ambient temperature of 5°C to
35°C (+40°F to +95°F) at sea level. The maximum allowable temperature is de-rated 1°C per 1,000 feet of
elevation above 5,000 feet above sea level up to 30°C at 10,000 feet. For optimum reliability and performance,
the recommended operating range is 20°C to 25°C and 40% – 55% relative humidity.
Ambient intake air temperature is often different from ambient room temperature; you should measure the
operating temperature and humidity directly in front of the cabinet cooling air intakes rather than just
checking ambient room conditions.

Environmental Temperature Sensor

The server includes internal sensors that monitor input air temperature and server operating temperatures.
The ambient air temperature is measured using a sensor placed on the system I/O board. Data from the
sensor is used to control the fan speed and to initiate system overtemperature shutdown.

Nonoperating Environment

The system is designed to withstand ambient temperatures between –40°C to 70°C under nonoperating
conditions.

Cooling

This section provides information on the cooling systems in the server.
CPU and Memory Cooling
The server incorporates front to back airflow across the processor and memory extender boards and through
the HDD backplane. Two 127 mm dual fan assemblies, mounted vertically in the center of the chassis, pull air
through the processor and memory section and push air through the PCI section.
52
LwA = 6.2 BA
c
b LwA = 6.4 BA
LwA = 6.4 BA
c
LwA = 7.2 BA
c
3048m (10,000 ft.) max
4600m (15,000 ft.) max
Value
Chapter 2