IBM 8669 - Eserver xSeries 342 Hardware Maintenance Manual page 69

a. Remove the thermal tape liner from the underside of the heat sink and
discard it.
Microprocessor
Tab (Rear)
release lever
b. Align and place the heat sink on the top of the microprocessor.
Note: Be sure the heat-sink guide fits between the microprocessor and the
microprocessor socket.
c. Press down and latch the spring-retention clip on the rear of the heat sink
onto the tab located on the rear of the microprocessor connector (the side
facing the rear of the server).
d. Press down and latch the spring-retention clip located at the front of the
heat sink onto the tab located on the front of the microprocessor socket
(the side facing the front of the server).
8. Reinstall the air-baffle assembly.
Attention: You must remove the air-flow guides from the air-baffle assembly
when you install an additional microprocessor on the system board. Otherwise,
the air-flow guides must remain in place to ensure proper air flow.
Heat sink
(Remove thermal tape
liner on installation)
Heat-sink guide
Ensure correct alignment
of heat sink
Tab (Front)
Air-flow guide 1
59
Installing options