Thermal Solution Quality And Reliability Requirements; Reference Heatsink Thermal Verification; Mechanical Environmental Testing; Use Conditions (Board Level) - Intel Core i7-800 Specifications

Thermal Solution Quality and Reliability Requirements

9
Thermal Solution Quality and
Reliability Requirements
9.1

Reference Heatsink Thermal Verification

Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. The Intel reference thermal solution will be evaluated to the
boundary conditions in
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3σ value for thermal characterization parameter using the TTV.
9.2

Mechanical Environmental Testing

Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. Some general recommendations are shown in
The Intel reference heatsinks will be tested in an assembled LGA1156 socket and
mechanical test package. Details of the environmental requirements, and associated
stress tests, can be found in
assumptions, and are provided as examples only.
Table 9-1.

Use Conditions (Board Level)

Test
Mechanical Shock
Random Vibration
Notes:
1. It is recommended that the above tests be performed on a sample size of at least ten assemblies from
multiple lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
Thermal/Mechanical Specifications and Design Guidelines
Chapter 5.
Table 9-1
1
3 drops each for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops)
Profile: 50 g, Trapezoidal waveform, 4.3 m/s [170 in/s]
minimum velocity change
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
2
5 Hz @ 0.01 g /Hz to 20 Hz @ 0.02 g
20 Hz to 500 Hz @ 0.02 g
Power Spectral Density (PSD) Profile: 3.13 g RMS
are based on speculative use condition
Requirement
2
/Hz (slope up)
2
/Hz (flat)
Table 9-1.
2
Pass/Fail Criteria
Visual Check and
Electrical Functional
Test
Visual Check and
Electrical Functional
Test
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