HP c-Class Overview page 5

QuickSpecs
HP BladeSystem c-Class Standard Features
HP BladeSystem c-Class HP BladeSystem c-Class HP BladeSystem c-Class HP BladeSystem c-Class
c3000 Enclosure c3000 Enclosure c3000 Enclosure c3000 Enclosure
A BladeSystem c3000 enclosure holds up to 8 server and/or storage blades plus redundant network and
storage switches. It includes a shared, multi-terabit high-speed mid-plane for wire-once connectivity of
server blades to network and shared storage. Power is delivered through a pooled power backplane that
ensures the full capacity of the hot-plug power supplies is available to all blades.
Each c3000 enclosure is built with the following functions:
Up to 8 half-height and/or up to 4 full-height server blades and/or storage blades per enclosure.
Up to 4 different interconnect fabrics (Ethernet, FC, IB, iSCSI, SAS, etc.) supported simultaneously
within the enclosure.
A single-phase power subsystem - for flexibility in connecting to datacenter power, or to UPS's or
to low-line wall outlets
PARSEC enclosure design - Parallel, redundant and scalable cooling and
airflow design
Four (4) or Six (6) Active Cool fans as standard. For redundancy and improved power
consumption and acoustics; additional Active Cool Fan kits can be added for a maximum of 10
fans
Fully redundant design-redundant interconnections between servers and interconnect modules; a
mid-plane with no active components; redundant cooling using hot-plug Active Cool fans; hot-
plug power supplies.
Best performance per watt - lower wattage per server blade, in comparison to rack-mounted
servers
Full AC redundancy - with no power zones.
Single or redundant Onboard Administrator management modules (optional active-standby
design)
An Onboard Administrator management module is built in to the enclosure with the following functions:
Robust, multiple enclosure setup and control.
Reports asset and inventory information for the devices in the enclosure.
Reports thermal and power information, including real-time actual power usage per server and
per enclosure.
Front-mounted Insight Display for easy management within the datacenter.
Integrated access to all server blade iLOs from a single cable.
Provides integrated access to interconnect bay device management ports from the single Onboard
Administrator cable.
Single sign-on capability for all devices in the enclosure
Role-based security locally and/or with LDAP directory services.
Provides a wizard-based initial setup process for easy configuration.
A BladeSystem c3000 enclosure provides the following benefits:
With local and remote hardware management integrated across the solution, one full enclosure
can be managed as easily as one server.
Scalable: Management and network interconnects extend scalability beyond a single enclosure,
allowing resources to be pooled and shared across multiple enclosures.
Investment protection: Accommodates multiple server and network designs in one enclosure.
Lower costs per server, in comparison to rack-mounted servers
Lower power consumption, in comparison to rack-mounted servers
Service and management: Allows multiple administrators to remotely access and maintain multiple
servers & interconnect devices simultaneously.
DA - 12517 Worldwide — Version 19 — September 15, 2008
HP BladeSystem c-Class Infrastructure HP BladeSystem c-Class Infrastructure HP BladeSystem c-Class Infrastructure HP BladeSystem c-Class Infrastructure
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