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HP c-Class Overview page 4

Hp bladesystem c-class infrastructure
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QuickSpecs
HP BladeSystem c-Class Standard Features
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HP BladeSystem Overview As server, storage and network technologies have changed; traditional rack-mounted infrastructure
HP BladeSystem Overview
HP BladeSystem Overview
HP BladeSystem Overview
http://isspit.corp.hp.com/document_storage/LaunchDeliverables/4AA0-5978ENW_Rev_1.PDF
solutions have generated increased complexity of both infrastructure management and physical
datacenter deployment.
HP BladeSystem is the evolution of the entire rack-mounted infrastructure. A BladeSystem reduces costs
and simplifies the management, building, and maintenance of the infrastructure behind your multi-server
environment. It consolidates and repackages all the supporting infrastructure elements-compute,
storage, network, and power into a single platform that can accelerate the integration and optimization
of your data center.
With the flexibility to scale from a single enclosure holding up to 16 blades, to a rack containing 4
enclosures holding up to 64 blades, the c-Class infrastructure is designed to meet the needs of today's
businesses.
An HP BladeSystem c-Class infrastructure is made up of several components:
ProLiant and Integrity Server blades for Windows, Linux, and HP UX.
Choice of AMD or Intel processors, including the latest dual-core processors for 32-bit and 64-bit
applications.
HP BladeSystem c-Class enclosure that provides connectivity, power, and cooling options. The c-
Class enclosure is designed for full redundancy and high availability. Redundant power, cooling,
enclosure management, and interconnect modules are part of the standard enclosure design.
Onboard Administrator module which provides a single point of control for intelligent
management of the entire enclosure.
Insight Display powered by the Onboard Administrator provides local management through an
LCD display conveniently sited on the front of the system.
Ethernet, Fibre Channel, InfiniBand, iSCSI, and other interconnect choices
A power subsystem that provides hot-plug redundant power modes and Dynamic Power Saving
mode, which uses up to 22% less power than traditional rack-mounted servers.
PARSEC (Parallel, Redundant, Scaleable, Enclosure Cooling) architecture: for maximum cooling
that consumes less power and reduces datacenter noise.
Zoned cooling that allows only those fans that are required to speed up, reducing power
consumption noise and airflow through the system.
Direct-attach storage blades, tape blades, or future shared storage blades, which will provide
block-based shared storage capacity for the server blades in the enclosure.
DA - 12517
Worldwide — Version 19 — September 15, 2008
HP BladeSystem c-Class Infrastructure
HP BladeSystem c-Class Infrastructure
HP BladeSystem c-Class Infrastructure
HP BladeSystem c-Class Infrastructure
Page 4

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Bladesystem c7000Bladesystem c3000