Micro-Fcpga Package Dimensions - Intel RH80536GC0332M - Pentium M 1.8 GHz Processor Datasheet

Package Mechanical Specifications and Pin Information
Table 4-1. Micro-FCPGA Package Dimensions
Symbol
A
–
A1
A2
A3
B
D
E
D1
E1
e
K
K1
K3
N
Pdie
W
NOTE: Overall height with socket is based on design dimensions of the Micro-FCPGA package with no thermal
solution attached. Values are based on design specifications and tolerances. This dimension is subject
to change based on socket design, OEM motherboard design or OEM SMT process.
50
Parameter
Overall height, top of die to package seating plane
Overall height, top of die to PCB surface, including
socket (Refer to Note 1)
Pin length
Die height
Pin-side capacitor height
Pin diameter
Package substrate length
Package substrate width
Die length
Die width
Pin Pitch
Package edge keep-out
Package corner keep-out
Pin-side capacitor boundary
Pin count
Allowable pressure on the die for thermal solution
Package weight
Package Surface Flatness
Min Max Unit
1.88 2.02 mm
4.74 5.16 mm
1.95 2.11 mm
0.820 mm
– 1.25 mm
0.28 0.36 mm
34.9 35.1 mm
34.9 35.1 mm
12.54 mm
6.99 mm
1.27 mm
5 mm
7 mm
14 mm
478 each
– 689 kPa
4.5 g
0.286 mm
Datasheet