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Table 4-2. Micro-FCBGA Package Dimensions
Symbol
A
A2
b
D
E
D1
E1
e
K
K1
K2
S
N
–
Pdie
W
NOTE: Overall height as delivered. Values are based on design specifications and tolerances. This dimension
is subject to change based on OEM motherboard design or OEM SMT process.
Datasheet
Package Mechanical Specifications and Pin Information
Parameter
Overall height, as delivered (Refer to Note 1)
Die height
Ball diameter
Package substrate length
Package substrate width
Die length
Die width
Ball Pitch
Package edge keep-out
Package corner keep-out
Die-side capacitor height
Package edge to first ball center
Ball count
Solder ball coplanarity
Allowable pressure on the die for thermal solution
Package weight
Min
Max
Unit
2.60
2.85
mm
0.82
mm
0.78
mm
34.9
35.1
mm
34.9
35.1
mm
12.54
mm
6.99
mm
1.27
mm
5
mm
7
mm
–
0.7
mm
1.625
mm
479
each
0.2
mm
–
689
kPa
4.5
g
53
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