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Table Of Contents - Intel RH80536GC0332M - Pentium M 1.8 GHz Processor Datasheet

Pentium m processor on 90 nm process with 2-mb l2 cache
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Contents
1
Introduction.................................................................................................................................... 7
1.1
Terminology .......................................................................................................................... 9
1.2
References ........................................................................................................................... 9
2
Low Power Features.................................................................................................................... 11
2.1
Clock Control and Low Power States ................................................................................. 11
2.1.1
Normal State .......................................................................................................... 11
2.1.2
AutoHALT Power-Down State ............................................................................... 11
2.1.3
Stop-Grant State .................................................................................................... 12
2.1.4
HALT/Grant Snoop State ....................................................................................... 12
2.1.5
Sleep State ............................................................................................................ 13
2.1.6
Deep Sleep State................................................................................................... 13
2.1.7
Deeper Sleep State ............................................................................................... 14
2.2
2.3
Front Side Bus Low Power Enhancements ........................................................................ 15
2.4
Processor Power Status Indicator (PSI#) Signal ................................................................ 15
3
Electrical Specifications ............................................................................................................. 17
3.1
Power and Ground Pins...................................................................................................... 17
3.1.1
FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 17
3.2
Voltage Identification .......................................................................................................... 17
3.3
Catastrophic Thermal Protection ........................................................................................ 18
3.4
Signal Terminations and Unused Pins................................................................................ 19
3.5
FSB Frequency Select Signals (BSEL[1:0]) ....................................................................... 19
3.6
FSB Signal Groups ............................................................................................................. 19
3.7
CMOS Signals .................................................................................................................... 20
3.8
Maximum Ratings ............................................................................................................... 21
3.9
Processor DC Specifications ..............................................................................................21
4
Package Mechanical Specifications and Pin Information ....................................................... 47
4.1
Processor Pinout and Pin List............................................................................................. 54
4.2
Alphabetical Signals Reference .......................................................................................... 70
5
Thermal Specifications and Design Considerations................................................................ 77
5.1
Thermal Specifications ....................................................................................................... 80
5.1.1
Thermal Diode ....................................................................................................... 80
5.1.2
Thermal Diode Offset............................................................................................. 81
5.1.3
Datasheet
®
Technology ........................................................................... 14
®
Thermal Monitor........................................................................................... 82
3

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