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6.2
Keep Out Zone Requirements
The keep out zone requirements on the PCB to use this heatsink are detailed in
"Mechanical
Drawings". Because it extends beyond the footprint of the device, it is critical for the
board designer to allocate space on the board for the heatsink.
6.3
Thermal Performance
The AdvancedTCA reference heatsink is an all copper (C1100) design. The performance of this
heatsink has been tested at flow rates from 10 CFM to 30 CFM. The heatsink is expected to meet the
thermal performance needed when the air flow rate is at least 10 CFM at 40 °C. For an external
ambient of 55°C (ψ
= 1.32 °C/W), this heatsink is expected to be suitable for air flow rates around
ja
15 CFM.
Figure 7.
AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate
6.4
1U+ Reference Heatsink
The 1U reference thermal solution is shown in
to 27 mm. The heatsink uses the fastener assembly (refer to
Detailed drawings of this heatsink are provided in
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
19
Core™ 2 Duo Mobile Processors—Reference Thermal Solutions
Figure
8. The maximum heatsink height is constrained
Section
Appendix B, "Mechanical
Appendix B,
6.6) to mount to the PCB.
Drawings".
Order Number: 320028-001
June 2008
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