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CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE...
Design manual
U Reference Heatsink Pcb Keep Out Requirements (Sheet 1 Of 2) - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual
Processors on 45-nm process for embedded applications
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Core™ 2 Duo Mobile Processors—Mechanical Drawings
Figure 23.
1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2)
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
June 2008
39
Order Number: 320028-001
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