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CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE...
Design manual
Primary Side Keep Out Zone Requirements- Micro-Fcpga - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual
Processors on 45-nm process for embedded applications
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Mechanical Specifications—Core™ 2 Duo Mobile Processors
Figure 2.
Primary Side Keep Out Zone Requirements— Micro-FCPGA
Notes:
1.
Dimension in millimeters [inches].
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008
TDG
Order Number: 320028-001
12
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